Senior Applications Engineer – SI/PI & 3D Packaging

Synopsys, Inc.; Sunnyvale (CA); On-site; USD 120,000 - 180,000; Full time

Job summary

Synopsys, Inc. is seeking a technical expert in signal integrity, power integrity, and advanced packaging to work directly with customers. You will run multi-physics simulations and provide actionable guidance to help customers optimize 3D IC designs and packaging.

Work will involve collaborating with product teams and traveling to customer sites about 25% of the time. A strong foundation in electrical engineering and hands-on experience with HFSS/SIwave/Q3D is required.

Qualifications

• 2+ years hands-on experience in 3D IC/advanced packaging design or analysis.
• Proficiency with HFSS, SIwave, Q3D, Ansys or Clarity for setup, run, and interpretation of multi-physics simulations.
• Strong knowledge of signal integrity and power integrity concepts including transmission lines, crosstalk, PDN, and resonance.

Responsibilities

• Engage with customers to understand signal integrity, power integrity, and advanced packaging challenges and demonstrate Synopsys solutions in their context.
• Run multi-physics simulations using HFSS, SIwave, Q3D, Ansys, Clarity or similar tools to validate performance and guide evaluations.
• Provide technical support and troubleshooting for 3D IC and advanced packaging designs, set up models, interpret results, and optimize workflows.
• Collaborate with product management and R&D to feed customer insights into the roadmap and prioritize features.

Skills

3D IC design

signal integrity

power integrity

multi-physics simulations

customer facing

Education

Bachelor's or Master's in Electrical Engineering

Tools

HFSS

SIwave

Q3D

Ansys

Clarity

Job description

Synopsys, Inc. is seeking a technical expert in signal integrity, power integrity, and advanced packaging to work directly with customers. You will run multi-physics simulations and provide actionable guidance to help customers optimize 3D IC designs and packaging.

Work will involve collaborating with product teams and traveling to customer sites about 25% of the time. A strong foundation in electrical engineering and hands-on experience with HFSS/SIwave/Q3D is required.