Senior Advanced Packaging Architect (3DIC/Interposers)

Synopsys, Inc.; San Diego (CA); On-site; USD 180,000 - 260,000; Full time

Job summary

Synopsys, Inc. in San Diego, CA is seeking a seasoned hardware engineering professional focused on advanced silicon package design and multi-physics analysis. You will drive SIPI performance, develop interposers and RDL-based packages, and guide silicon packaging strategies with Synopsys IPs.

You will collaborate with cross-functional teams, mentor peers, and lead technical discussions in a fast-paced environment, supporting customer engagements and innovation initiatives.

Qualifications

• Bachelor’s degree in Electrical or Electronic Engineering; Master’s or PhD preferred.
• Minimum 10 years in advanced package design, model extraction, and analysis.
• Expert knowledge of advanced circuit and transmission line theory.
• Hands-on with leading package technologies (TSMC, Intel, Samsung, OSAT).
• Proficiency in multi-physics analysis (EMIR, Thermal, Thermal-Mechanical, EM).
• Experience with Windows and Linux; familiarity with major EDA tools.

Responsibilities

• Collaborate with cross-functional teams to optimize SIPI performance requirements, including bump mapping and power estimation.
• Design and develop advanced silicon package solutions such as silicon interposers, RDL fanout, and silicon bridge packages.
• Model and analyze designs for electrical, thermal, and mechanical performance.
• Represent Synopsys as a technical leader on advanced packaging projects.
• Resolve design and integration issues with data-driven approaches.
• Support customer engagements exploring advanced package solutions with Synopsys IPs.
• Collaborate with global teams to share best practices and drive innovation.

Skills

Advanced packaging design

Multi-physics analysis

EM/Thermal/EMI theory

Windows and Linux

EDA tools proficiency

Education

Bachelor’s in Electrical or Electronic Engineering

Master’s or PhD preferred

Tools

Cadence APD

Innovus

Integrity-3DIC

Synopsys ICC2

3DIC Compiler

Fusion Compiler

Job description

Synopsys, Inc. in San Diego, CA is seeking a seasoned hardware engineering professional focused on advanced silicon package design and multi-physics analysis. You will drive SIPI performance, develop interposers and RDL-based packages, and guide silicon packaging strategies with Synopsys IPs.

You will collaborate with cross-functional teams, mentor peers, and lead technical discussions in a fast-paced environment, supporting customer engagements and innovation initiatives.