Staff Applications Engineer – Electronics Packaging

Ansys, Inc.; Sunnyvale (CA); On-site; USD 120,000 - 190,000; Full time

Job summary

Synopsys is seeking a senior Applications Engineer to lead technical engagements across the sales cycle, using Ansys tools to address structural, thermal, or reliability challenges in electronics packaging. You will configure, script, and deploy simulations within customers’ CAD/PLM environments and build Python automation to drive repeatable analysis.

You will collaborate with product teams, deliver training, and create practical examples that demonstrate value.

Qualifications

• BS in Mechanical Engineering or related field with 5+ years in an engineering software environment, or MS with 3+ years, or PhD with industry exposure to structural, thermal, or reliability simulation.
• Deep subject matter expertise in structural mechanics applied to electronics or semiconductor domains, including packaging, PCB assemblies, or chip-level reliability analysis.
• Hands-on experience with Ansys software or other commercial CAE tools like COMSOL, Abaqus, or similar platforms used for finite element analysis.
• Strong Python scripting skills with demonstrated experience building automation workflows, integrating APIs, or developing custom applications on top of commercial engineering software.
• Ability to diagnose complex simulation problems, communicate technical tradeoffs clearly to both engineers and business stakeholders, and write documentation or presentations in fluent English.

Responsibilities

• Lead technical engagements throughout the sales cycle, from discovery calls where you map customer workflows to live demos where you show how Ansys software solves their specific structural, thermal, or reliability challenges
• Work directly with semiconductor and electronics packaging engineers to understand their design problems, then configure, script, and deploy simulation solutions using Ansys tools that fit into their existing CAD and PLM environments
• Build Python-based automation scripts and custom workflows using Ansys APIs to help customers move from manual, one-off analyses to repeatable, scalable simulation processes
• Collaborate with Ansys product teams to translate what you are hearing from customers into feature requests, test pre-release builds on real-world problems, and document best practices that become part of the product roadmap
• Deliver consulting services and training sessions, from introductory workshops to deep-dive technical implementations, helping customers get value from day one
• Support field marketing efforts by authoring technical content, presenting at industry conferences, and creating application examples that demonstrate differentiated value in electronics and semiconductor markets
• Travel to customer sites, trade shows, and internal meetings up to 25% of the time, with flexibility to increase based on project needs

Skills

Python scripting

Electronics packaging

Customer-facing

Engineering software

Education

BS in Mechanical Engineering

MS/PhD in related field

Tools

Ansys

COMSOL

Abaqus

Job description

Synopsys is seeking a senior Applications Engineer to lead technical engagements across the sales cycle, using Ansys tools to address structural, thermal, or reliability challenges in electronics packaging. You will configure, script, and deploy simulations within customers’ CAD/PLM environments and build Python automation to drive repeatable analysis.

You will collaborate with product teams, deliver training, and create practical examples that demonstrate value.