Senior Silicon Packaging Architect – Advanced 3DIC

Synopsys, Inc.; Sunnyvale (CA); On-site; USD 150,000 - 190,000; Full time

Job summary

Synopsys, Inc. is seeking an experienced hardware engineering professional specializing in advanced silicon package design.

You will lead cross-functional efforts to optimize SIPI performance, including bump mapping and power estimation, and develop interposers and RDL fanout packages for high-performance silicon solutions. You will model, simulate, and validate electrical, thermal, and mechanical aspects while collaborating with global teams and customers to drive innovation in packaging

Qualifications

• Bachelor’s degree in Electrical or Electronic Engineering (Master’s or PhD preferred).
• Minimum of 10 years’ relevant experience in advanced package design, model extraction, and analysis.
• Expert knowledge of advanced circuit and transmission line theory.
• Hands-on experience with TSMC, Intel, Samsung, or OSAT advanced package technologies.
• Proficiency in multi-physics analysis (EMIR, Thermal, Thermal-Mechanical, Electromagnetic, etc.).
• Familiarity with Windows and Linux operating systems.

Responsibilities

• Collaborating with cross-functional teams during early design stages to optimize SIPI performance requirements.
• Designing and developing advanced silicon package solutions such as silicon interposers and RDL fanout packages.
• Modeling and analyzing advanced package designs to ensure electrical, thermal, and mechanical performance.
• Representing Synopsys as a technical leader and subject matter expert in advanced packaging.
• Resolving design and integration issues using data-driven approaches.
• Supporting customer engagements in exploring and implementing advanced package solutions with Synopsys IPs.
• Collaborating with global teams to share best practices and drive innovation in packaging methodologies.

Skills

Advanced packaging

10+ years experience

3DIC knowledge

Multi-physics analysis

Signal integrity

Cadence tools

OSAT/IC packaging tech

Windows & Linux

Education

Bachelors in Electrical/Electronic Eng

Master’s or PhD preferred

Tools

Cadence APD

Innovus

Integrity-3DIC

Synopsys ICC2

3DIC Compiler

Fusion Compiler

Job description

Synopsys, Inc. is seeking an experienced hardware engineering professional specializing in advanced silicon package design.

You will lead cross-functional efforts to optimize SIPI performance, including bump mapping and power estimation, and develop interposers and RDL fanout packages for high-performance silicon solutions. You will model, simulate, and validate electrical, thermal, and mechanical aspects while collaborating with global teams and customers to drive innovation in packaging