Senior Applications Engineer, SI & 3D IC Packaging

Ansys, Inc.

Sunnyvale (CA)

On-site

USD 140,000 - 210,000

Full time

14 days+

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Job summary

Synopsys is leading in semiconductor design and analytics, delivering SI, PI, and advanced packaging solutions to enable customers to innovate faster. You will guide customers through complex multi-physics simulations, set up models, and provide hands-on technical support across 3D IC and advanced packaging designs.

You will collaborate with product management and R&D to translate field feedback into roadmap priorities; travel to customer sites (~25%), and deliver compelling demos and technical

Qualifications

  • 2+ years hands-on experience in 3D IC and advanced packaging design or analysis
  • Proficiency with at least one of HFSS, SIwave, Q3D, Ansys, or Clarity and ability to set up, run, and interpret multi-physics simulations
  • Strong working knowledge of signal integrity and power integrity principles
  • Ability to work directly with customers in evaluations, support, or training
  • Willingness to travel to customer sites ~25% of the time
  • Bachelor's or Master's degree in Electrical Engineering or related field
  • Experience with thermal or electrothermal analysis is a plus

Responsibilities

  • Engage directly with new and existing customers to understand SI, PI, and advanced packaging challenges and demonstrate how Synopsys tools solve them
  • Run multi-physics simulations using HFSS, SIwave, Q3D, Ansys, Clarity, or similar tools to validate product performance and guide evaluations
  • Provide technical support and troubleshooting for 3D IC and advanced packaging designs, setting up models and interpreting results
  • Collaborate with product management and R&D to feed customer insights into roadmaps and feature priorities
  • Travel to customer sites for onsite evaluations, training, and reviews (~25%)
  • Build and deliver technical presentations, application notes, and proofs-of-concept demos showing measurable value
  • Stay current on SI, PI, and thermal trends in advanced packaging and share insights internally/externally

Skills

HFSS
SIwave
Q3D
Ansys
Clarity
Customer interaction
Multi-physics simulations

Education

Bachelor's or Master's in Electrical Engineering

Tools

HFSS
SIwave
Q3D
Ansys
Clarity

Job description

Synopsys is leading in semiconductor design and analytics, delivering SI, PI, and advanced packaging solutions to enable customers to innovate faster. You will guide customers through complex multi-physics simulations, set up models, and provide hands-on technical support across 3D IC and advanced packaging designs.

You will collaborate with product management and R&D to translate field feedback into roadmap priorities; travel to customer sites (~25%), and deliver compelling demos and technical

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