Senior Advanced Packaging Process Leader

Micron Technology, Inc.; Boise (ID); On-site; USD 180,000 - 240,000; Full time

Job summary

Micron Technology, Inc. seeks a veteran organizational leader to guide and influence advanced packaging process development for memory products (HBM, 3DS DRAM, 3D architectures).

You will drive end-to-end technology execution, partner across functions, and shape internal roadmaps and external ecosystems. The role emphasizes data-driven decision-making, AI-enabled tooling, and collaboration with suppliers and R&D to accelerate learning and deliver high-impact solutions.

Qualifications

• MS in Chemistry, Chemical Engineering, Materials Science, or related field (or equivalent experience).
• 15+ years in semiconductor process development, manufacturing, or advanced packaging.
• Deep expertise in wafer-level or die-level processes such as CMP, etch, cleans, thin films, lithography, hybrid bonding, TCB, dicing, or molding.
• Strong understanding of semiconductor process integration and materials interactions.
• Proven experience leading complex cross-functional technical programs.

Responsibilities

• Own advanced packaging process technologies across wafer-level and die-level modules from pathfinding through manufacturing readiness.
• Develop and mature novel process flows, materials, and integration schemes that meet electrical, mechanical, thermal, cost, and reliability needs.
• Lead FOAK development, supplier engagement, and ecosystem collaboration to close capability gaps and accelerate learning.
• Drive structured problem solving for multi-domain technical challenges and guide strategic decisions across programs.
• Lead technology transfer to manufacturing and influence packaging and integration decisions across product teams.
• Expected to leverage AI-enabled tools, automation, data analytics, and advanced modeling methods to accelerate process development, strengthen decision-making, and improve technical outcomes across advanced packaging programs.

Skills

Leadership

Data-driven decisions

AI/Advanced analytics

Process development

Cross-functional collaboration

Education

MS in Chemistry, Chemical Engineering, Materials Science, or related field

PhD in a relevant technical field

Job description

Micron Technology, Inc. seeks a veteran organizational leader to guide and influence advanced packaging process development for memory products (HBM, 3DS DRAM, 3D architectures).

You will drive end-to-end technology execution, partner across functions, and shape internal roadmaps and external ecosystems. The role emphasizes data-driven decision-making, AI-enabled tooling, and collaboration with suppliers and R&D to accelerate learning and deliver high-impact solutions.