Director, Advanced DRAM Packaging & Tech Strategy

Micron; Boise (ID); On-site; USD 250,000 - 350,000; Full time

Job summary

Micron Technology seeks a Director of DRAM Packaging to lead strategy for the memory portfolio, define technology roadmaps, and build a high‑performing global engineering organization. This executive role combines technical depth with business insight to accelerate innovation and deliver industry‑leading packaging technologies.

You will guide long‑term packaging strategies, including HBM, LPDRAM, DDR, and 2.5D/3D integration, while partnering with design, manufacturing, quality, and customers to

Qualifications

• Bachelor’s degree in Engineering, Materials Science, Physics, Computer Engineering, or related field.
• 15+ years in semiconductor packaging, including development to high‑volume manufacturing.
• 10+ years leading engineering teams or global programs.
• Expertise in HBM, LPDRAM, DDR, 3D stacking, heterogeneous integration.
• Experience guiding technology decisions with cross‑functional partners.

Responsibilities

• Define and execute long‑term DRAM packaging strategies for future products.
• Lead development and deployment of advanced packaging tech (HBM, 2.5D/3D, chiplets).
• Drive AI, analytics, and digital engineering to improve product development and manufacturing.
• Build and lead a global packaging organization focused on innovation and execution.
• Partner with design, product engineering, manufacturing, quality, supply chain, and customers.

Skills

Engineering leadership

Semiconductor packaging

HBM / 3D stacking

Cross-functional collaboration

Technical decision making

Education

Bachelor's degree in engineering or related field

Master's/PhD preferred

Job description

Micron Technology seeks a Director of DRAM Packaging to lead strategy for the memory portfolio, define technology roadmaps, and build a high‑performing global engineering organization. This executive role combines technical depth with business insight to accelerate innovation and deliver industry‑leading packaging technologies.

You will guide long‑term packaging strategies, including HBM, LPDRAM, DDR, and 2.5D/3D integration, while partnering with design, manufacturing, quality, and customers to