Director, DRAM Packaging & 3D Integration

Micron Technology; Boise (ID); On-site; USD 180,000 - 240,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off

Paid holidays

Job summary

Micron Technology seeks a visionary Director of DRAM Packaging to lead strategy, development and execution of advanced packaging across its memory portfolio. You will define roadmaps, drive innovation in architectures, and build a high-performing global engineering organization.

This executive role requires technical depth, strategic business sense and strong customer engagement to accelerate innovation and strengthen Micron’s competitive position.

Qualifications

• 15+ years in semiconductor packaging delivering advanced technologies from development through high-volume manufacturing.
• 10+ years leading engineering teams, programs, or global organizations.
• Expertise in packaging technologies such as HBM, LPDRAM, DDR, 3D stacking, and heterogeneous integration.
• Proven ability to drive roadmaps, decisions, and multi-functional collaboration.

Responsibilities

• Define and execute long-term DRAM packaging strategies that support product, technology and business objectives.
• Lead development and deployment of advanced packaging technologies (HBM, 2.5D/3D, heterogeneous integration).
• Drive AI, machine learning, analytics, and digital engineering to boost productivity in product development and manufacturing.
• Build and lead a global packaging organization focused on innovation and operational excellence.
• Partner with design, product engineering, manufacturing, quality, supply chain and tech development to deliver products from concept to high-volume manufacturing.

Skills

Leadership

Strategic planning

Executive communication

AI & analytics

Global team leadership

Education

Bachelor’s degree in engineering

Master’s degree or PhD (preferred)

Tools

CAD software

3D packaging tools

Job description

Micron Technology seeks a visionary Director of DRAM Packaging to lead strategy, development and execution of advanced packaging across its memory portfolio. You will define roadmaps, drive innovation in architectures, and build a high-performing global engineering organization.

This executive role requires technical depth, strategic business sense and strong customer engagement to accelerate innovation and strengthen Micron’s competitive position.