Process Engineer, Advanced Packaging & Automation

Micron Technology; Boise (ID); On-site; USD 90,000 - 130,000; Full time

Benefits offered by this job

Medical plan

Dental plan

Vision plan

Paid time off

Paid holidays

Retirement benefits

Job summary

Micron Technology is seeking a Process Engineer to improve quality, reliability, and manufacturability of future memory products. The role blends hands-on problem solving, process optimization, and cross-functional collaboration in a fast-paced development environment.

You will drive technical advancements, influence roadmaps, and contribute to next-generation semiconductor solutions through partnership with global R&D and manufacturing teams.

Qualifications

• BS with 3+ years of experience or MS with 1+ year or PhD in a technical field
• Experience in semiconductor process engineering or packaging
• Knowledge of DRAM, NAND, or other memory technologies
• Experience with DOE, SPC, defect analysis, and data analysis
• Ability to solve complex technical problems and manage projects

Responsibilities

• Optimize automation, equipment, and process performance to improve product quality and cost
• Develop and enhance host, automation, and data systems to accelerate learning and decision-making
• Perform root cause analysis and failure investigations using DOE, 8D, SPC, and FDC
• Partner with equipment, process development, and process integration teams to implement solutions
• Support pilot line operations and technology transfer to high-volume manufacturing sites

Skills

Semiconductor process engineering

Packaging/advanced package integration

Memory technologies (DRAM, NAND)

DOE

SPC

Data analysis

Root cause analysis

Education

BS in Materials Science / Chemical Eng / Electrical Eng / Mechanical Eng / Chemistry / Physics

MS in relevant field

PhD in related technical field

Job description

Micron Technology is seeking a Process Engineer to improve quality, reliability, and manufacturability of future memory products. The role blends hands-on problem solving, process optimization, and cross-functional collaboration in a fast-paced development environment.

You will drive technical advancements, influence roadmaps, and contribute to next-generation semiconductor solutions through partnership with global R&D and manufacturing teams.