Director, DRAM Packaging: AI-Driven 3D/HBM Innovation

Micron Technology, Inc

Boise (ID)

On-site

USD 220,000 - 320,000

Full time

6 days ago
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Job summary

Micron Technology, Inc. is seeking a Director of DRAM Packaging to drive strategy, development, and execution of advanced packaging across memory portfolios.

You will define roadmaps, lead a global engineering organization, and partner across design, manufacturing, quality, and supply chain to deliver state-of-the-art packaging solutions. In this executive role you will build scalable processes, advance AI-driven design and digital engineering, and shape technology investments while maintaining

Qualifications

  • Bachelor’s degree in engineering or related field required.
  • Experience leading engineering teams or global programs.
  • Expertise in advanced packaging technologies such as HBM, LPDRAM, DDR, 3D stacking.

Responsibilities

  • Define and execute long-term DRAM packaging strategies aligned to business goals.
  • Lead development and deployment of advanced packaging technologies (HBM, DDR, 2.5D/3D).
  • Drive AI, analytics and digital engineering to improve product development and manufacturing.
  • Build and lead a global packaging organization focused on innovation and execution.
  • Partner with design, manufacturing, quality, supply chain and technology teams.
  • Establish strategic relationships with customers, OSATs, foundries and suppliers.
  • Oversee technology investments through benchmarking, cost analysis and risk assessment.
  • Foster scalable engineering processes and data-driven decision making.

Skills

Leadership
Strategic planning
AI/ML awareness
Digital engineering
Global teams

Education

Bachelor’s degree in Engineering or related field
Master’s degree or PhD (preferred)

Tools

HBM packaging
2.5D/3D integration
Chiplets

Job description

Micron Technology, Inc. is seeking a Director of DRAM Packaging to drive strategy, development, and execution of advanced packaging across memory portfolios.

You will define roadmaps, lead a global engineering organization, and partner across design, manufacturing, quality, and supply chain to deliver state-of-the-art packaging solutions. In this executive role you will build scalable processes, advance AI-driven design and digital engineering, and shape technology investments while maintaining

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