Senior Advanced Packaging Engineer (2.5D/3D)
Apple, Inc.
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Benefits offered by this job
Job summary
Apple, Inc. is seeking an experienced Advanced Packaging Engineer in the San Francisco Bay Area to drive 2.5D/3D packaging, high-density interconnects, and hybrid bonding.
You will engage with leading foundries/OSATs to define specs, process windows, and architecture, enabling next-generation Apple silicon performance. You will collaborate across cross-functional teams to deliver optimized solutions, lead DOE builds, and ensure DFM alignment with foundry rules.
Qualifications
- BS degree in engineering or related field.
- MS/PhD and 6+ years in advanced wafer-level packaging.
Responsibilities
- Collaborate across package architecture to meet electrical, mechanical, and thermal requirements.
- Lead test vehicle definition, floorplanning, tapeout, and DOE plans with foundries.
- Review GDS/ layout data for DRC/LVS and DFM alignment with foundry rules.
- Drive data collection and yield tracking across wafer steps for process optimization.
- Conduct failure analysis and root-cause investigations for wafer-level excursions.
- Apply AI/ML techniques to convert datasets into actionable process insights.
Skills
Education
Tools
Job description
Apple, Inc. is seeking an experienced Advanced Packaging Engineer in the San Francisco Bay Area to drive 2.5D/3D packaging, high-density interconnects, and hybrid bonding.
You will engage with leading foundries/OSATs to define specs, process windows, and architecture, enabling next-generation Apple silicon performance. You will collaborate across cross-functional teams to deliver optimized solutions, lead DOE builds, and ensure DFM alignment with foundry rules.
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