Advanced Package Development Engineer

Apple; United States; On-site; USD 185,000 - 325,000; Full time

Benefits offered by this job

Stock options

Relocation assistance

Comprehensive benefits

Tuition reimbursement

Job summary

Apple, Inc. is seeking an experienced Advanced Packaging Engineer in the San Francisco Bay Area to drive 2.5D/3D packaging, high-density interconnects, and hybrid bonding.

You will engage with leading foundries/OSATs to define specs, process windows, and architecture, enabling next-generation Apple silicon performance. You will collaborate across cross-functional teams to deliver optimized solutions, lead DOE builds, and ensure DFM alignment with foundry rules.

Qualifications

• BS degree in engineering or related field.
• MS/PhD and 6+ years in advanced wafer-level packaging.

Responsibilities

• Collaborate across package architecture to meet electrical, mechanical, and thermal requirements.
• Lead test vehicle definition, floorplanning, tapeout, and DOE plans with foundries.
• Review GDS/ layout data for DRC/LVS and DFM alignment with foundry rules.
• Drive data collection and yield tracking across wafer steps for process optimization.
• Conduct failure analysis and root-cause investigations for wafer-level excursions.
• Apply AI/ML techniques to convert datasets into actionable process insights.

Skills

Packaging architectures

GDS/Mask review

DFM alignment

DOE/NPI ownership

Data analytics (AI/ML)

Cross-functional interfacing

Education

BS in Engineering

MS/PhD in related field

Tools

Calibre

Virtuoso

KLayout

Job description

San Francisco Bay Area, California, United States Hardware

Join the team behind the technology in a billion pockets worldwide. Apple's Advanced Packaging Program is seeking engineers to drive package integration and technology development for next-generation products. In this role, you'll contribute to the advanced packaging technologies that enable Apple's industry-leading silicon performance. You'll work alongside world-class engineers to solve complex integration challenges and bring new packaging innovations from concept to mass production.

Description

• You will be responsible for advanced packaging development and pathfinding.
• Drive engagement with leading-edge foundries/OSATs to lead package integration, process definition, and architecture efforts.
• Define specs, drive process windows, and establish advanced packaging solutions (2.5D/3D, hybrid bonding, high-density wafer-level interconnects).

Responsibilities

• Collaborate with cross-functional domains through the package architecture and definition process to deliver optimized solutions meeting electrical, mechanical, and thermal requirements.
• Drive process definition, baseline flow development, and margin validation in close collaboration with foundry/OSAT partners.
• Lead test vehicle (TV) definition, floorplanning, tapeout execution, and DOE build plans with foundries through development and NPI phases.
• Perform layout and GDS/mask review (GDSII/OASIS), ensuring DRC/LVS compliance and design-for-manufacturing (DFM) alignment with foundry design rules.
• Lead comprehensive data collection, statistical data analysis, and yield tracking across wafer-level process steps to drive yield enhancement and process centering.
• Drive failure analysis (FA), root-cause investigations, and issue resolution for wafer-level process excursions, defectivity, and reliability marginalities.
• Apply advanced data analytics and AI/ML techniques to convert complex foundry inline/metrology datasets into actionable process optimization insights.

Minimum Qualifications

• BS and 10+ years of experience in relevant industry experience.

Preferred Qualifications

• MS/PhD and 6+ years of relevant industry experience in advanced wafer-level packaging.
• Deep technical expertise in advanced packaging architectures and foundry processes
• Hands-on experience reviewing GDS/layout data, physical verification (DRC/LVS), and working with IC layout/viewing tools (e.g., Calibre, Virtuoso, KLayout).
• Proven track record managing foundry partners, defining DOEs, driving NPI engineering builds, and analyzing inline/end-of-line metrology and electrical test data.
• Solid background in packaging physics, multi-domain interactions (thermo-mechanical, warpage, thin-wafer handling, reliability, and SI/PI fundamentals).
• Strong problem-solving, analytical rigor, and communication skills to interface effectively with cross-functional and overseas foundry/OSAT partners.

At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $184,700 and $324,800, and your base pay will depend on your skills, qualifications, experience, and location.

Apple employees also have the opportunity to become an Apple shareholder through participation in Apple’s discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple’s Employee Stock Purchase Plan. You’ll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses — including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits

Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.

Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant

At Apple, we believe accessibility is a fundamental human right. You’ll find that idea reflected in everything here — in our culture, our benefits and our digital tools. By welcoming as many perspectives as possible, we help you build a career where you feel like you belong.

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Apple accepts applications to this posting on an ongoing basis.