Lead IC Packaging & Integration Engineer

Apple, Inc.; Cupertino (CA); Presencial; USD 185 000 - 325 000; Tempo integral

Vantagens oferecidas por esta oferta de emprego

Employee stock purchase plan

Relocation assistance

Discretionary bonuses

Resumo da oferta

Apple, Inc. is seeking an experienced IC Packaging Engineering Lead in the San Francisco Bay Area.

The role focuses on leading package integration and architecture efforts, coordinating with Silicon, Packaging, and Systems engineering to deliver high-density, high-performance interconnects for advanced devices. Responsibilities include driving packaging technology development, collaborating with OSATs and assembly partners, and ensuring designs meet electrical, mechanical, thermal, and

Qualificações

• BS in engineering with 10+ years of industry experience.
• Experience in Semiconductor Packaging Design and development.
• Strong cross-functional collaboration and problem solving.
• Excellent communication skills enabling cross-functional work with teams and suppliers.

Responsabilidades

• Lead package co-design with silicon, packaging, and systems teams to meet electrical, mechanical, thermal, and reliability specs.
• Drive development of packaging technology with broad impact (new tech, structure, cost reductions).
• Collaborate with assembly partners from development to high-volume production.
• Create design docs, design rules, risk assessments, and release checklists for silicon to production.

Conhecimentos

Semiconductor packaging

Cross-functional teamwork

Problem solving

Communication skills

Formação académica

BS in engineering

MS/PhD in related field

Ferramentas

Cadence APD/Allegro

Descrição da oferta de emprego

Apple, Inc. is seeking an experienced IC Packaging Engineering Lead in the San Francisco Bay Area.

The role focuses on leading package integration and architecture efforts, coordinating with Silicon, Packaging, and Systems engineering to deliver high-density, high-performance interconnects for advanced devices. Responsibilities include driving packaging technology development, collaborating with OSATs and assembly partners, and ensuring designs meet electrical, mechanical, thermal, and