Senior 2.5D/3D Packaging Engineer – Hybrid Bonding & TSVs

Apple, Inc.; California; Presencial; USD 185 000 - 325 000; Tempo integral

Vantagens oferecidas por esta oferta de emprego

Stock programs

Relocation assistance

Comprehensive benefits

Resumo da oferta

Apple’s Advanced Packaging team in the San Francisco Bay Area seeks an experienced Packaging Development Engineer to drive next‑generation 2.5D/3D packaging integration for future products. You will lead definition, development, and qualification of cutting‑edge packaging technologies including hybrid bonding, interposers, and TSVs.

The role requires coordination across silicon design, SI/PI, thermal, and manufacturing teams from concept through qualification and high‑volume manufacturing.

Qualificações

• BS and 10+ years of relevant industry experience.
• PhD and 6+ years of experience in relevant industry is preferred.
• Strong technical background in 2.5D/3D packaging and semiconductor integration schemes.

Responsabilidades

• Develop Advanced Packaging Architectures: lead the definition, development, and qualification of advanced packaging technologies with hybrid bonding, fine-pitch microbumps, interposers, and TSVs.
• Define and execute test vehicles: design experimental test vehicles, establish packaging design rules, and lead characterization to validate novel interconnect concepts for product integration.
• Manage chip–package interaction and reliability: assess CPI risks, correlate mechanical and thermal stress behaviors, and work with failure analysis to resolve yield and material issues.
• Drive cross‑functional co‑optimization: collaborate with architecture, silicon design, SI/PI, and thermal teams to evaluate system tradeoffs across performance, power, reliability, and cost.
• Lead external technology partners: direct foundry and OSAT partners on roadmaps, targets, schedules, and high-volume manufacturing ramp.

Conhecimentos

2.5D packaging

3D packaging

hybrid bonding

TSVs

interposers

wafer‑level packaging

Formação académica

Bachelor's degree

PhD

Descrição da oferta de emprego

Apple’s Advanced Packaging team in the San Francisco Bay Area seeks an experienced Packaging Development Engineer to drive next‑generation 2.5D/3D packaging integration for future products. You will lead definition, development, and qualification of cutting‑edge packaging technologies including hybrid bonding, interposers, and TSVs.

The role requires coordination across silicon design, SI/PI, thermal, and manufacturing teams from concept through qualification and high‑volume manufacturing.