Advanced Packaging Development Engineer

Apple, Inc.; California; On-site; USD 185,000 - 325,000; Full time

Benefits offered by this job

Stock programs

Relocation assistance

Comprehensive benefits

Job summary

Apple’s Advanced Packaging team in the San Francisco Bay Area seeks an experienced Packaging Development Engineer to drive next‑generation 2.5D/3D packaging integration for future products. You will lead definition, development, and qualification of cutting‑edge packaging technologies including hybrid bonding, interposers, and TSVs.

The role requires coordination across silicon design, SI/PI, thermal, and manufacturing teams from concept through qualification and high‑volume manufacturing.

Qualifications

• BS and 10+ years of relevant industry experience.
• PhD and 6+ years of experience in relevant industry is preferred.
• Strong technical background in 2.5D/3D packaging and semiconductor integration schemes.

Responsibilities

• Develop Advanced Packaging Architectures: lead the definition, development, and qualification of advanced packaging technologies with hybrid bonding, fine-pitch microbumps, interposers, and TSVs.
• Define and execute test vehicles: design experimental test vehicles, establish packaging design rules, and lead characterization to validate novel interconnect concepts for product integration.
• Manage chip–package interaction and reliability: assess CPI risks, correlate mechanical and thermal stress behaviors, and work with failure analysis to resolve yield and material issues.
• Drive cross‑functional co‑optimization: collaborate with architecture, silicon design, SI/PI, and thermal teams to evaluate system tradeoffs across performance, power, reliability, and cost.
• Lead external technology partners: direct foundry and OSAT partners on roadmaps, targets, schedules, and high-volume manufacturing ramp.

Skills

2.5D packaging

3D packaging

hybrid bonding

TSVs

interposers

wafer‑level packaging

Education

Bachelor's degree

PhD

Job description

San Francisco Bay Area, California, United States Hardware

Apple's Advanced Packaging team is seeking an experienced Packaging Development Engineer to drive next-generation packaging integration and technology development for future products. In this role, you will lead the definition, development, and qualification of cutting-edge 2.5D and 3D packaging technologies - incorporating features such as hybrid bonding, high-density interposers, fine-pitch microbumps, and Through-Silicon Vias (TSVs).You will work cross-functionally with silicon design, physical design, SI/PI, thermal, and manufacturing teams to guide technologies from early architecture exploration through qualification and high-volume manufacturing.

Description

In this role, you will be responsible for advanced package integration and technology development within a cross-functional team, driving novel 2.5D/3D architectures from early concept through qualification.

Responsibilities

• Develop Advanced Packaging Architectures: Lead the definition, development, and qualification of advanced packaging technologies featuring hybrid bonding, fine-pitch microbumps, interposers, and TSVs.
• Define & Execute Test Vehicles: Design experimental test vehicles, establish packaging design rules, and lead characterization to validate novel interconnect concepts and build confidence for product integration.
• Manage Chip-Package Interaction & Reliability: Assess CPI risks, correlate mechanical and thermal stress behaviors, and partner with failure analysis teams to resolve yield, material, and structural challenges.
• Drive Cross-Functional Co-Optimization: Collaborate across architecture, silicon design, SI/PI, and thermal teams to evaluate holistic system trade-offs across performance, power, reliability, and cost.
• Lead External Technology Partners: Direct foundry and OSAT partners on technology roadmaps, process capability targets, development schedules, and high-volume manufacturing ramp.

Minimum Qualifications

• BS and 10 +years of relevant industry experience

Preferred Qualifications

• PhD and 6+ years of experience in relevant industry, preferred.
• Strong technical background in 2.5D/3D packaging and semiconductor integration schemes (such as hybrid bonding, interposers, fine-pitch microbumps, and TSVs).
• Solid grasp of fab BEoL/MEoL interconnect processing, wafer-level packaging, and advanced assembly flows.
• Understanding of packaging materials, thermo-mechanical reliability, and chip-package interaction failure mechanisms.
• Broad systems mindset with the ability to balance package-level choices against silicon, electrical, thermal, and manufacturing constraints.
• Experience utilizing layout, physical design, or modeling tools alongside engineering data analysis.
• Proven track record collaborating with and driving external foundries, OSATs, or material vendors.
• Excellent communication and collaboration skills across cross-functional hardware teams.

At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $184,700 and $324,800, and your base pay will depend on your skills, qualifications, experience, and location.

Apple employees also have the opportunity to become an Apple shareholder through participation in Apple's discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple's Employee Stock Purchase Plan. You'll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses - including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits

Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.

Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant

At Apple, we believe accessibility is a fundamental human right. You'll find that idea reflected in everything here - in our culture, our benefits and our digital tools. By welcoming as many perspectives as possible, we help you build a career where you feel like you belong.

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Apple accepts applications to this posting on an ongoing basis.