Lead Scientist - Advanced Packaging & Chiplet Integration

A*STAR Research; Hawaii; On-site; USD 120,000 - 180,000; Full time

Benefits offered by this job

State-of-the-art facilities

IP portfolio development

Job summary

A*STAR Research seeks a Scientist or Senior Scientist to advance 2.5D interposer and 3D stacking assembly processes for heterogeneous integration. You will drive micro-bump bonding and chip-to-wafer technologies, collaborating with design and wafer teams to set design rules and roadmaps.

The role requires a PhD and 5–10 years in semiconductor packaging, with demonstrated leadership in complex project execution and external partnerships across North America, Europe, and Asia.

Qualifications

• PhD in relevant field with 5–10 years in semiconductor packaging.
• Strong analytical skills and experience with statistical methods.
• Experience with JEDEC/IPC/ JESD standards and failure analysis.

Responsibilities

• Lead flip chip bonding and chip-to-wafer hybrid bonding development for heterogeneous integration.
• Collaborate with design and process teams to define assembly rules and roadmaps.
• Engage stakeholders, manage projects, and drive IP development in packaging.
• Mentor researchers and participate in conferences and external partnerships.

Skills

Project management

Cross-functional collaboration

Analytical problem-solving

DOE & SPC

Statistical analysis (JMP/Minitab)

Education

PhD in Materials Science & Engineering or related field

Tools

JMP

Minitab

Job description

A*STAR Research seeks a Scientist or Senior Scientist to advance 2.5D interposer and 3D stacking assembly processes for heterogeneous integration. You will drive micro-bump bonding and chip-to-wafer technologies, collaborating with design and wafer teams to set design rules and roadmaps.

The role requires a PhD and 5–10 years in semiconductor packaging, with demonstrated leadership in complex project execution and external partnerships across North America, Europe, and Asia.