Senior Advanced Packaging Engineer - 2.5D/3D Innovation

Apple; United States; Sur place; USD 150 000 - 200 000; Plein temps

Résumé du poste

Apple is seeking a Senior Engineer for Advanced Packaging to drive 2.5D/3D packaging development and integration with premier foundries/OSATs. You will define specs, lead DOE and test vehicles, and ensure DFM-aligned layouts.

Join a world-class team responsible for packaging architectures, thermal/mechanical reliability, and data-driven process optimization for next-generation products.

Qualifications

• BS degree with 10+ years in advanced wafer-level packaging
• MS or PhD with 6+ years in relevant industry experience
• Deep technical expertise in advanced packaging architectures and foundry processes
• Hands-on experience reviewing GDS/layout data, physical verification (DRC/LVS)
• Experience with IC layout/viewing tools (Calibre, Virtuoso, KLayout)

Responsabilités

• Develop and lead advanced packaging development and pathfinding.
• Collaborate with foundries/OSATs on integration, process definition, and architecture.
• Define specs, drive process windows, and establish 2.5D/3D packaging solutions.
• Lead test vehicle definition, floorplanning, tapeout with foundries in NPI.
• Perform layout and GDS/mask review, ensuring DRC/LVS and DFM alignment.
• Lead data collection, statistical analysis, and yield tracking across wafer steps.
• Drive failure analysis, root-cause investigations, and issue resolution for process excursions.
• Apply AI/ML to convert metrology data into actionable process insights.

Connaissances

Advanced packaging

Foundry collaboration

DFM/DFT

Statistical data analysis

AI/ML analytics

NPI engineering

GDS/Mask review

DOE planning

Layout tools experience

Data-driven optimization

Formation

BS degree

MS or PhD

Outils

Calibre

Virtuoso

KLayout

Description du poste

Apple is seeking a Senior Engineer for Advanced Packaging to drive 2.5D/3D packaging development and integration with premier foundries/OSATs. You will define specs, lead DOE and test vehicles, and ensure DFM-aligned layouts.

Join a world-class team responsible for packaging architectures, thermal/mechanical reliability, and data-driven process optimization for next-generation products.