Senior Advanced Packaging Engineer — 2.5D/3D Solutions

Apple, Inc.; San Francisco (CA); Sur place; USD 185 000 - 325 000; Plein temps

Résumé du poste

Apple's Advanced Packaging Program in San Francisco seeks engineers to drive package integration and technology development for next‑generation products. You will work with world‑class engineers to translate 2.5D/3D packaging concepts from concept to mass production.

You will collaborate with foundries, define specs, run DOEs and NPIs, lead tapeouts, and apply data analytics to optimize yield and reliability while shaping packaging architectures and DFM with IC layout tools.

Qualifications

• BS and 10+ years of experience in relevant industry experience.
• MS/PhD with 6+ years in advanced wafer-level packaging.
• Deep expertise in advanced packaging architectures and foundry processes.
• Hands-on experience reviewing GDS/layout data, physical verification (DRC/LVS), and tools like Calibre/Virtuoso/KLayout.
• Proven track record managing foundry partners, DOEs, NPIs, and metrology analysis.
• Solid background in packaging physics and multi‑domain interactions.

Responsabilités

• Collaborate across domains to meet electrical, mechanical, and thermal specs.
• Drive process definition, baseline flow, and margin with foundry partners.
• Lead TV definition, floorplanning, tapeout, and DOE plans with foundries.
• Review layout data and ensure DFM alignment with design rules.
• Collect data, analyze yield, and track wafer-level metrics.
• Investigate failures and root causes of process excursions.
• Apply AI/ML to convert metrology data into optimization insights.

Connaissances

Advanced packaging

Packaging integration

Data analysis

Cross-functional collaboration

DOE development

Formation

BS

MS/PhD

Outils

GDSII

OASIS

Calibre

Virtuoso

KLayout

Description du poste

Apple's Advanced Packaging Program in San Francisco seeks engineers to drive package integration and technology development for next‑generation products. You will work with world‑class engineers to translate 2.5D/3D packaging concepts from concept to mass production.

You will collaborate with foundries, define specs, run DOEs and NPIs, lead tapeouts, and apply data analytics to optimize yield and reliability while shaping packaging architectures and DFM with IC layout tools.