Advanced Package Technology Engineer

Broadcom, Inc.; Fort Collins (CO); On-site; USD 140,000 - 210,000; Full time

Job summary

Broadcom, Inc. is seeking an Advanced Package Technology Engineer in Fort Collins, CO to drive 2.5D/3D packaging technology.

You will collaborate with silicon and package design, marketing, NPI, and suppliers to define needs and deliver high-performance, cost-effective packaging that meets signal integrity and thermal requirements. As Technology Leader, you will oversee 2.5D/3D development, manage external partners for qualification, and work with cross-functional teams on design, test, and

Qualifications

• PhD or MS in Mechanical, Electrical, or Electronics Engineering.
• 10+ years of relevant experience in advanced packaging.
• Experience with 2.5D/3D packaging, interposers, substrates, and wafer-level packaging.

Responsibilities

• Technology Leadership in 2.5D and 3D advanced packaging.
• Lead identification, development, and qualification of packaging solutions with external partners.
• Cross-functional collaboration with Design Integration, Package Design, and Test Development.

Skills

2.5D packaging

3D packaging

Heterogeneous integration

Thermal modelling

Mechanical modelling

AutoCAD

SolidWorks

Wafer-level packaging

Interposers

Substrates

Education

PhD or MS in Mechanical/Electrical/Electronic Eng

Tools

APD

AutoCAD

SolidWorks

Job description

Advanced Package Technology Engineer page is loaded## Advanced Package Technology Engineerlocations: USA-CA San Jose Innovation Drive: USA-Colorado-Fort Collins-4380 Ziegler Roadtime type: Full timeposted on: Posted Todayjob requisition id: R027541**Please Note:****1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)****2. If you already have a Candidate Account, please Sign-In before you apply.**## **Job Description:****Role Overview**As a key member of the Worldwide (WW) ASIC Product Development team, you will collaborate closely with silicon and package design, marketing, NPI, assembly/substrate suppliers, and customers. You will lead the development of cost-effective, high-performance, advanced custom packaging solutions that meet stringent signal integrity, thermal, structural reliability, design rule, and project schedule requirements.With 2.5D and 3D technologies pushing the boundaries of modern packaging, you will play a pivotal role in driving cutting-edge architectures to meet future customer and product demands.**Key Responsibilities*** **Technology Leadership:** Serve as the subject matter expert in 2.5D and 3D advanced packaging technologies, engaging with current and future customers to define needs, consolidate requirements, and drive unified solutions.* **Partner & Program Management:** Lead the identification, development, and qualification of advanced packaging solutions, overseeing program management with external assembly and memory partners to define technology and quality requirements.* **Cross-Functional Collaboration:** Interface seamlessly with internal technical teams - including Design Integration, Package Design, and Test Development - as part of a dynamic cross-functional team.* **NPI & Sourcing Support:** Support new design wins, New Product Introduction (NPI), and high-volume manufacturing ramps, while driving alternate sourcing and qualification initiatives.**Candidate Qualifications & Requirements*** **Education & Experience:** Ph.D./ Master's degree in Mechanical, Electrical, or Electronics Engineering, with 10+ years of relevant experience.* **Packaging Expertise:** Proven track record in developing cost-effective, high-performance (optimized for speed, density, pin count, thermal performance, and reliability) single- and multi-chip solutions.* **Substrates & Interposers:** Experience with large, complex, custom, and fine-pitch flip-chip packaging solutions utilizing advanced multi-layer ceramic/organic substrates and interposers, as well as wafer-level packaging solutions.**Specific Qualifications*** **Advanced Packaging:** 6+ years of hands-on experience in 2.5D / 3D package development and heterogeneous integration.* **Process & Materials Know-How:** In-depth understanding of advanced silicon fabrication, bumping, interposer, substrate, and assembly processes, alongside materials selection, supplier evaluation, BOM definition, and thermal-mechanical interactions.**Additional Competencies*** **Technical Skills:**+ Comprehensive knowledge of prevailing and emerging silicon, package, and substrate technologies, design rules, failure analysis techniques, materials, equipment, and industry standards/quality systems.+ Hands-on experience using thermal and mechanical modelling tools, alongside substrate/PCB design CAD tools (e.g., APD, AutoCAD, SolidWorks) for design optimization.+ Solid understanding of advanced-node silicon fabrication, PCB technologies, and board assembly processes.* **Soft Skills:** A self-driven, flexible, agile, and results-oriented team player with strong analytical, problem-solving, project management, and interpersonal skills. Proven ability to conceptualize structured projects, innovate around complex problems, and manage multiple programs concurrently.* **Communication & Travel:** Excellent communication skills for extensive collaboration with global internal/external teams and customers. Periodic travel may be required.**Compensation and Benefits**The annual base salary range for this position is USD To USDAs a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.**Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.****If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.**