Senior IC Packaging & Integration Engineer

Apple, Inc.; Jackson (TN); On-site; USD 185,000 - 325,000; Full time

Benefits offered by this job

Comprehensive medical and dental

Retirement benefits

Employee stock programs

Employee Stock Purchase Plan

Discounted products and services

Relocation assistance

Job summary

Apple, Inc. is seeking a versatile IC Packaging Engineer to join our team in the United States.

You will develop IC packaging and lead SoC package integration and architecture efforts, working with cross-functional partners to deliver high-density, reliable interconnect solutions. You will apply advanced AI/ML and data analytics to optimize processes, evaluate new materials, and ensure mechanical, thermal, and electrical performance.

Qualifications

• BS and 10+ years of experience in relevant industry.
• MS/PhD and 6+ years in semiconductor packaging or system integration.
• Strong understanding of multi-functional packaging areas and reliability, testing, FA and package-system integration.

Responsibilities

• IC packaging development.
• Lead SoC package integration and architecture efforts.
• Drive advanced packaging solutions, materials, and reliability.

Skills

Semiconductor packaging

System integration

FOWLP/2.5D/3D packaging

Allegro schematic review

Problem solving

Communication skills

Education

Bachelor's degree

MS/PhD in related field

Tools

Allegro

Job description

Apple, Inc. is seeking a versatile IC Packaging Engineer to join our team in the United States.

You will develop IC packaging and lead SoC package integration and architecture efforts, working with cross-functional partners to deliver high-density, reliable interconnect solutions. You will apply advanced AI/ML and data analytics to optimize processes, evaluate new materials, and ensure mechanical, thermal, and electrical performance.