A leading semiconductor company located in Orlando, Florida is seeking a highly skilled professional to design advanced semiconductor packages. The role involves extensive use of Cadence Allegro Package Designer, conducting electrical and mechanical analyses, and collaborating with design teams on layout optimization. Candidates must have a Bachelor's degree in Electrical Engineering and over 5 years of experience in semiconductor packaging design. Relocation assistance is available for the right candidate.
Qualifications
5+ years of experience in semiconductor packaging design, modeling, and simulations.
Strong authority on Cadence Allegro Package Designer Plus (APD+).
Experience with interposer and substrate layouts in advanced package technologies.
Good experience with Signal Integrity and Power Integrity tools.
Responsibilities
Design advanced semiconductor packages, focusing on layout and optimization.
Conduct electrical simulations using Cadence and Sigrity tools.
Work with design teams to optimize layouts and package requirements.
Perform mechanical analysis using Ansys tools.
Skills
Cadence Allegro Package Designer Plus (APD+)
Electrical simulations
Mechanical analysis
Signal Integrity (SI)
Power Integrity (PI)
Solidworks
AWR software
HFSS Software
Education
Bachelor's degree in Electrical Engineering or related field
Tools
Cadence Allegro APD+
Ansys
Sigrity Advanced SI II
Sigrity Advanced PI II
Momentum
Job description
A leading semiconductor company located in Orlando, Florida is seeking a highly skilled professional to design advanced semiconductor packages. The role involves extensive use of Cadence Allegro Package Designer, conducting electrical and mechanical analyses, and collaborating with design teams on layout optimization. Candidates must have a Bachelor's degree in Electrical Engineering and over 5 years of experience in semiconductor packaging design. Relocation assistance is available for the right candidate.