Quantum Packaging Thermal Architect

Intel Corporation; Hillsboro, Northern (OR, KY); Hybrid; USD 142,000 - 200,000; Full time

Job summary

Intel Corporation's Quantum Packaging Modeling Engineer role in Oregon focuses on thermal modeling and simulation of packaging hardware, from silicon test chips to heat spreaders, enabling cross-disciplinary co-design. You will partner with mechanical designers and stakeholders to deliver robust, efficient thermal solutions and report milestones with clear documentation.

The position requires strong communication, analytical thinking, and adaptability to a fast-paced quantum research

Qualifications

• MS/PhD in a related field with 5+ years of thermal modeling experience in packaging.
• Experience with thermal/mechanical modeling, simulation, and optimization using Ansys Icepak and COMSOL.
• Understanding of packaging technologies and thermal integration.
• Excellent communication and presentation skills; ability to work across teams.

Responsibilities

• Thermal modeling and simulation of packaging hardware to understand heat flow from silicon test chips through heat spreader hardware.
• Manage the overall integration of the packaging hardware and enable co-design between stakeholders.
• Work with mechanical designers to define heat spreaders for optimal performance.
• Deliver design milestones to stakeholders and present designs in documentation.
• Stay current with packaging technology developments by reading papers and attending conferences.

Skills

Communication skills

Analytical thinking

Collaboration

Adaptability

Presentation skills

Education

MS in Electrical Engineering, Physics or related field

PhD in Electrical Engineering, Physics or related field

Tools

Ansys Icepak

COMSOL

Job description

## Job Description:Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Modeling Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for thermal modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. **Key Responsibilities** - Thermal modeling and simulation of packaging hardware to understand how heat flows from silicon test chips through various heat spreader hardware - Manage the overall integration of the packaging hardware and enable co-design between relevant stakeholders - Work closely with mechanical designers to define heat spreaders for optimal performance - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers **As a successful candidate, you must possess** - Excellent communication and presentation skills for technical and non-technical audiences - Strong analytical thinking and problem-solving capabilities - Collaborative mindset with ability to work effectively across diverse teams - Adaptability to work in a fast-paced, innovative research environment - Passion for pushing the boundaries of quantum technology development Join Intel's Quantum Computing Group where we are building the future of quantum computing. If you're passionate about working at the forefront of quantum computing packaging and want to work with the resources and expertise of the world's leading semiconductor company, we want to hear from you. Apply today and discover your place in our world-changing work.## **Qualifications:**You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of relevant industry job experience, internship experience and/or schoolwork/classes/research. **Minimum Qualifications:** - M.S. degree in Electrical Engineering, Physics or related field AND 5+ years of experience in in Thermal modeling and simulation for packaging, or other related hardware. - OR Ph.D. degree in Electrical Engineering, Physics or related field with academic or work experience in the related areas. *The experience must include:* - Experience with thermal/mechanical modeling, simulation, and optimization with simulation software such as Ansys Icepak, COMSOL, and related. - Understanding of packaging technologies and thermal integration. **Preferred Qualifications:** - 2+ years of experience with thermal/mechanical cryogenic packaging modeling and simulation.## Job Type:Experienced Hire## Shift:Shift 1 (United States of America)## Primary Location:US, Oregon, Hillsboro## Additional Locations:## Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.## ## Position of TrustN/A## BenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.Annual Salary Range for jobs which could be performed in the US: $141,910.00-200,340.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.**Work Model for this Role**This role will require an on-site presence. \\* Job posting details (such as work model, location or time type) are subject to change.