Quantum Packaging Thermal Architect: Heat for Quantum Dots

Intel Corporation; Hillsboro (OR); On-site; USD 142,000 - 200,000; Full time

Benefits offered by this job

Competitive pay

Stock bonuses

Health benefits

Retirement plan

Paid vacation

Job summary

Intel Corporation in Oregon's Hillsboro campus is seeking a Quantum Packaging Modeling Engineer to drive thermal modeling and simulation for silicon packaging and quantum hardware. You will partner with packaging, mechanical design, and research teams to model heat flow and optimize designs for scalable quantum systems.

The role emphasizes cross-disciplinary collaboration, clear technical communication, and staying current with packaging advances, with an on-site work model in the United States.

Qualifications

• MS or PhD with experience in thermal modeling and simulation for packaging or related hardware.
• Experience with thermal/mechanical modeling, simulation, and optimization using Ansys Icepak, COMSOL, and related.
• Understanding of packaging technologies and thermal integration.

Responsibilities

• Thermal modeling and simulation of packaging hardware to understand heat flow from silicon test chips through various heat spreader hardware
• Manage the overall integration of the packaging hardware and enable co-design between relevant stakeholders
• Work closely with mechanical designers to define heat spreaders for optimal performance
• Deliver and disseminate design milestones to stakeholders
• Communicate designs in presentations and relevant documentation
• Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers

Skills

Communication skills

Analytical thinking

Collaboration

Adaptability

Quantum tech passion

Education

MS in Electrical Engineering or Physics

PhD in Electrical Engineering or Physics

Tools

Ansys Icepak

COMSOL

Job description

Intel Corporation in Oregon's Hillsboro campus is seeking a Quantum Packaging Modeling Engineer to drive thermal modeling and simulation for silicon packaging and quantum hardware. You will partner with packaging, mechanical design, and research teams to model heat flow and optimize designs for scalable quantum systems.

The role emphasizes cross-disciplinary collaboration, clear technical communication, and staying current with packaging advances, with an on-site work model in the United States.