Process Integration Engineer – 2.5D/3D Packaging

Micron; Boise (ID); On-site; USD 120,000 - 180,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time-off

Paid holidays

Job summary

Micron Technology is seeking a Process Integration Engineer for Advanced Packaging to develop and integrate 2.5D/3D packaging architectures, including HBM and hybrid bonding. You will collaborate across disciplines to improve performance, yield, and manufacturability of next-generation devices.

The role requires 8+ years in advanced packaging, with hands-on experience in TSVs, die stacking, and reliability. Join a team driving cutting-edge packaging solutions at Micron.

Qualifications

• Bachelor's degree in Materials, Chemical or related field with 8+ years in advanced packaging technology development.
• Experience with 2.5D/3D integration, HBM, and hybrid bonding.
• Experience with TSVs, die stacking, underfill, molding, bonding, and package integration.
• Experience with reliability and cross-functional engineering programs in fast-paced environments.

Responsibilities

• Develop and optimize advanced packaging technologies including 2.5D/3D integration, HBM, and hybrid bonding.
• Design and execute experiments to qualify materials, process flows, and design rules for new package architectures.
• Analyze yield, performance, and defect data to identify process improvements using SPC and analytics.
• Drive technology transfer including process qualification, design rules, material selection, and manufacturing readiness.
• Collaborate across design, process, equipment, reliability, test, and manufacturing teams to deliver high-performance packaging solutions.

Skills

2.5D/3D packaging

HBM integration

Hybrid bonding

Wafer-to-wafer

Cross-functional collaboration

Education

Bachelor's degree in Materials/Chemical Engineering or related field

Tools

TSVs

Interconnects

Die stacking

Underfill

Molding/Bonding

Job description

Micron Technology is seeking a Process Integration Engineer for Advanced Packaging to develop and integrate 2.5D/3D packaging architectures, including HBM and hybrid bonding. You will collaborate across disciplines to improve performance, yield, and manufacturability of next-generation devices.

The role requires 8+ years in advanced packaging, with hands-on experience in TSVs, die stacking, and reliability. Join a team driving cutting-edge packaging solutions at Micron.