Director, Advanced Packaging Process Integration (2.5D/3D)

Micron; Boise (ID); On-site; USD 180,000 - 240,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid time off

Paid holidays

Job summary

Micron Technology in Boise, Idaho is seeking a Process Integration Lead for Advanced Packaging. You will lead a team driving 2.5D/3D packaging development from concept to manufacturing and shape roadmaps for next‑gen platforms while mentoring highly skilled engineers.

You will collaborate with design, process, equipment, reliability, test and manufacturing teams to deliver scalable packaging solutions, optimize yield, and transfer technology into production.

Qualifications

• Bachelor’s degree in Materials Engineering, Chemical Engineering, or related field with 15+ years in advanced packaging development (2.5D/3D, HBM).
• Experience with interconnects, TSVs, die stacking, underfill, molding, bonding, and package integration.
• Experience leading teams and AI-enabled engineering workflows in semiconductor development.

Responsibilities

• Manage and grow a team responsible for seamless process integration across 2.5D and 3D packaging platforms, including advanced interconnect architectures, die-stacking solutions, and HBM implementation.
• Spearhead the development, optimization, and qualification of emerging packaging technologies through experimental design (DOE), process analysis, performance validation, and establishment of design rules.
• Improve yield, reliability, and performance using defect analysis, electrical and physical characterization, SPC, and data-driven root cause investigation
• Lead technology transfer from development to manufacturing, including materials qualification, process readiness, baseline characterization, and validation planning
• Partner with design, process, equipment, reliability, test, and manufacturing teams to deliver advanced packaging solutions and scale proven methodologies across global organizations
• Warpage engineering: predict and mitigate wafer/die warpage via modeling, cure‑shrinkage controls, and material/process levers; validate with inline metrology.

Skills

Advanced packaging

2.5D/3D stacking

HBM integration

DOE / Design of Experiments

Data-driven root cause analysis

AI-enabled workflows

Team leadership

Cross-functional collaboration

Education

Bachelor's degree in Materials or Chemical Engineering

Master's degree

PhD

Job description

Micron Technology in Boise, Idaho is seeking a Process Integration Lead for Advanced Packaging. You will lead a team driving 2.5D/3D packaging development from concept to manufacturing and shape roadmaps for next‑gen platforms while mentoring highly skilled engineers.

You will collaborate with design, process, equipment, reliability, test and manufacturing teams to deliver scalable packaging solutions, optimize yield, and transfer technology into production.