Director, Advanced Packaging: 2.5D/3D & HBM Integration

Micron Technology; Boise (ID); On-site; USD 180,000 - 240,000; Full time

Benefits offered by this job

Medical, dental, vision plans

Paid time off

Paid holidays

Job summary

Micron Technology in Boise seeks a Process Integration Lead for Advanced Packaging to guide a team developing and integrating 2.5D/3D packaging technologies from concept to manufacturing. You will drive technology transfer, design rules, and cross-functional collaboration to enable high-performance multi-die solutions.

You will mentor engineers, shape the roadmap for next-generation packaging platforms, and lead efforts in yield, reliability, and data-driven optimization across global teams.

Qualifications

• 15+ years of experience in advanced packaging technology development (2.5D/3D stacking, HBM) and package integration.
• Experience with advanced interconnects, TSVs, die stacking, underfill, molding, bonding, and package integration processes.
• Experience with hybrid bonding integration (W2W/C2W) and HBM-to-logic integration, including thermal optimization.
• Experience defining AI-enabled engineering workflows, developing automation agents, or applying AI tools to semiconductor development.
• Experience leading collaborative technical teams and driving complex engineering programs to completion.

Responsibilities

• Manage and grow a team responsible for seamless process integration across 2.5D and 3D packaging platforms, including advanced interconnect architectures, die-stacking solutions, and HBM implementation.
• Spearhead development, optimization, and qualification of emerging packaging technologies through DOE, process analysis, performance validation, and design rule establishment.
• Improve yield, reliability, and performance using defect analysis, electrical and physical characterization, SPC, and data-driven root cause investigation.
• Lead technology transfer from development to manufacturing, including materials qualification, process readiness, baseline characterization, and validation planning.
• Partner with design, process, equipment, reliability, test, and manufacturing teams to deliver advanced packaging solutions and scale proven methodologies across global organizations.
• Warpage engineering: predict and mitigate wafer/die warpage via modeling, cure-shrinkage controls, and material/process levers; validate with inline metrology.

Skills

Advanced packaging

2.5D packaging

HBM integration

AI-enabled workflows

Team leadership

Education

Bachelor’s degree in Materials/ Chemical Engineering

Tools

DOE (Design of Experiments)

Automation tools

AI tooling in semiconductor development

Job description

Micron Technology in Boise seeks a Process Integration Lead for Advanced Packaging to guide a team developing and integrating 2.5D/3D packaging technologies from concept to manufacturing. You will drive technology transfer, design rules, and cross-functional collaboration to enable high-performance multi-die solutions.

You will mentor engineers, shape the roadmap for next-generation packaging platforms, and lead efforts in yield, reliability, and data-driven optimization across global teams.