Process Integration Engineer, Advanced Packaging (2.5D/3D)

Micron Technology; Boise (ID); On-site; USD 120,000 - 180,000; Full time

Job summary

Micron Technology is seeking a Process Integration Engineer for Advanced Packaging to develop and integrate 2.5D/3D architectures, including HBM and hybrid bonding. You will work across engineering disciplines to create new processes, improve performance and yield, and transfer technologies to manufacturing.

You will lead cross-functional efforts, analyze data to drive improvements, and support wafer-to-wafer and chip-to-wafer reliability, with a focus on thermal optimization and scalable

Qualifications

• Bachelor’s degree in Materials Engineering, Chemical Engineering, or related field with 8+ years of experience in advanced packaging development
• Experience with 2.5D, 3D stacking, and HBM integration
• Experience with TSVs, advanced interconnects, die stacking, underfill, molding, bonding, and package integration processes
• Experience with hybrid bonding integration and reliability, including wafer-to-wafer or chip-to-wafer processes
• Experience with HBM and logic integration, including thermal optimization
• Experience supporting cross-functional engineering programs in a fast-paced development environment

Responsibilities

• Develop and optimize advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnects
• Design and execute experiments to qualify materials, process flows, and design rules for new package architectures
• Analyze yield, performance, and defect data to identify process improvements using SPC and advanced analytics
• Drive technology transfer, including process qualification, design rules, material selection, and manufacturing readiness
• Warpage engineering: predict and mitigate wafer/die warpage via modeling, cure‑shrinkage controls, and material/process levers; validate with inline metrology
• Collaborate with design, process, equipment, reliability, test, and manufacturing teams to deliver high-performance packaging solutions

Skills

TSVs

Advanced interconnects

Die stacking

Underfill

Molding

Bonding

Package integration

Cross-functional collaboration

Education

Bachelor’s degree in Materials Engineering, Chemical Engineering, or related field

Tools

Data analytics

Automation

AI workflows

Job description

Micron Technology is seeking a Process Integration Engineer for Advanced Packaging to develop and integrate 2.5D/3D architectures, including HBM and hybrid bonding. You will work across engineering disciplines to create new processes, improve performance and yield, and transfer technologies to manufacturing.

You will lead cross-functional efforts, analyze data to drive improvements, and support wafer-to-wafer and chip-to-wafer reliability, with a focus on thermal optimization and scalable