Director / DMTS, Process Integration Lead - Advanced Packaging (2.5D/3D, HBM, Hybrid Bonding)

Micron; Boise (ID); On-site; USD 180,000 - 240,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid time off

Paid holidays

Job summary

Micron Technology in Boise, Idaho is seeking a Process Integration Lead for Advanced Packaging. You will lead a team driving 2.5D/3D packaging development from concept to manufacturing and shape roadmaps for next‑gen platforms while mentoring highly skilled engineers.

You will collaborate with design, process, equipment, reliability, test and manufacturing teams to deliver scalable packaging solutions, optimize yield, and transfer technology into production.

Qualifications

• Bachelor’s degree in Materials Engineering, Chemical Engineering, or related field with 15+ years in advanced packaging development (2.5D/3D, HBM).
• Experience with interconnects, TSVs, die stacking, underfill, molding, bonding, and package integration.
• Experience leading teams and AI-enabled engineering workflows in semiconductor development.

Responsibilities

• Manage and grow a team responsible for seamless process integration across 2.5D and 3D packaging platforms, including advanced interconnect architectures, die-stacking solutions, and HBM implementation.
• Spearhead the development, optimization, and qualification of emerging packaging technologies through experimental design (DOE), process analysis, performance validation, and establishment of design rules.
• Improve yield, reliability, and performance using defect analysis, electrical and physical characterization, SPC, and data-driven root cause investigation
• Lead technology transfer from development to manufacturing, including materials qualification, process readiness, baseline characterization, and validation planning
• Partner with design, process, equipment, reliability, test, and manufacturing teams to deliver advanced packaging solutions and scale proven methodologies across global organizations
• Warpage engineering: predict and mitigate wafer/die warpage via modeling, cure‑shrinkage controls, and material/process levers; validate with inline metrology.

Skills

Advanced packaging

2.5D/3D stacking

HBM integration

DOE / Design of Experiments

Data-driven root cause analysis

AI-enabled workflows

Team leadership

Cross-functional collaboration

Education

Bachelor's degree in Materials or Chemical Engineering

Master's degree

PhD

Job description

Our vision is to transform how the world uses information to enrich life for all .

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Department Intro:

We are advancing the future of semiconductor packaging through innovative 2.5D, 3D, and heterogeneous integration technologies. Our team develops the processes that enable next-generation AI and high-performance computing products, working across materials, device, design, manufacturing, and test engineering to solve complex technical challenges. If you're excited by emerging packaging architectures and breakthrough integration approaches, you'll find meaningful opportunities to make an impact here.

Position Overview:

As a Process Integration Lead for Advanced Packaging, you will lead a team focused on developing and integrating advanced packaging technologies from concept through full-scale manufacturing. This role plays a critical part in enabling high-performance multi-die solutions by driving technology development, process integration, technology transfer, and collaborative execution. You will help shape the roadmap for next-generation packaging platforms while mentoring a highly skilled technical team.

Responsibilities:

• Manage and grow a team responsible for seamless process integration across 2.5D and 3D packaging platforms, including advanced interconnect architectures, die-stacking solutions, and HBM implementation.
• Spearhead the development, optimization, and qualification of emerging packaging technologies through experimental design (DOE), process analysis, performance validation, and establishment of design rules.
• Improve yield, reliability, and performance using defect analysis, electrical and physical characterization, SPC, and data-driven root cause investigation
• Lead technology transfer from development to manufacturing, including materials qualification, process readiness, baseline characterization, and validation planning
• Partner with design, process, equipment, reliability, test, and manufacturing teams to deliver advanced packaging solutions and scale proven methodologies across global organizations
• Warpage engineering: predict and mitigate wafer/die warpage via modeling, cure‑shrinkage controls, and material/process levers; validate with inline metrology.

Minimum Qualifications:

• Bachelor's degree in Materials Engineering, Chemical Engineering, or a related field with 15+ years of experience to include advanced packaging technology development, 2.5D, 3D stacking, and HBM integration
• Experience with advanced interconnects, TSVs, die stacking, underfill, molding, bonding, and package integration processes
• Experience with hybrid bonding integration (W2W/C2W) and HBM-to-logic integration, including thermal optimization
• Experience defining AI-enabled engineering workflows, developing automation agents, or applying AI tools to semiconductor development
• Experience leading collaborative technical teams and driving complex engineering programs to completion

Preferred Qualifications:

• Master's degree or PhD
• Experience developing and scaling advanced packaging technologies from research and development through full-scale manufacturing
• Expertise in yield analysis, statistical process control, defect reduction, and data-driven process optimization
• Experience with warpage modeling, material characterization, and package reliability qualification
• Author or contributor to technical publications, patents, or industry presentations related to advanced packaging technologies

Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.

• Micron offers a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
• Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
• Additionally, Micron benefits include a robust paid time-off program and paid holidays.

For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.