Principal Packaging Architect for Next-Gen SoCs

Velaura AI, Inc.; Santa Clara (CA); On-site; USD 200,000 - 300,000; Full time

Job summary

Velaura AI, Inc. seeks a Principal Packaging Engineer to own the package architecture and development for our next-generation SoCs.

You will lead packaging from concept through production, coordinating with silicon, board, thermal, mechanical, and manufacturing teams to optimize performance, cost, and manufacturability. The ideal candidate has deep experience in advanced semiconductor packaging, substrate technologies, and cross-functional optimization.

Qualifications

• Deep experience developing advanced semiconductor packages for high-performance SoCs.
• Strong understanding of package architecture, substrate technologies, bumping, assembly flows, and manufacturing.
• Experience co-optimizing package design with silicon, board, SI/PI, thermal, and mechanical teams.
• Hands-on experience with signal integrity, power integrity, thermal, and reliability.
• Ability to balance technical excellence with cost, yield, manufacturability, and schedule.
• Excellent communication skills and a collaborative, first-principles engineering mindset.

Responsibilities

• Own package architecture from concept through production for Velaura SoCs.
• Partner with architecture and silicon teams to co-optimize package, die, board, and system design for performance, power, cost, and manufacturability.
• Drive package technology selection, including flip-chip, advanced substrates, fan-out, and future multi-die integration approaches.
• Lead package design, bump planning, substrate definition, escape routing, and assembly interactions with OSAT and substrate vendors.
• Own package-level signal integrity and power integrity planning for high-speed interfaces including LPDDR, PCIe, Ethernet, and other high-speed I/O.
• Collaborate on thermal architecture, mechanical integration, reliability, DFM, and qualification.
• Work with foundry, assembly, substrate, and test partners to successfully deliver products to production.
• Help define Velaura’s long-term packaging roadmap as future products evolve.

Skills

Packaging architecture

Signal integrity

Power integrity

Thermal management

Cross-functional collaboration

Manufacturing/processability

Flip-chip/advanced substrates

OSAT coordination

Job description

Velaura AI, Inc. seeks a Principal Packaging Engineer to own the package architecture and development for our next-generation SoCs.

You will lead packaging from concept through production, coordinating with silicon, board, thermal, mechanical, and manufacturing teams to optimize performance, cost, and manufacturability. The ideal candidate has deep experience in advanced semiconductor packaging, substrate technologies, and cross-functional optimization.