Senior Packaging Engineer, AI Accelerator Systems

Annapurna Labs; Austin (TX); On-site; USD 185,000 - 250,000; Full time

Benefits offered by this job

Health insurance

Job summary

Annapurna Labs designs silicon and software that accelerate innovation for AI accelerators and cloud solutions. The Packaging Technology Development team leads the packaging, substrate/PCB, interposer, and assembly work for next‑generation Trainium systems, collaborating with silicon, board, system, and supply chain teams to bring bleeding‑edge AI hardware from concept to volume production.

The team seeks engineers who can optimize cost, yield, warpage, and reliability while driving new

Qualifications

• Experience coordinating across multiple technical teams and stakeholders.
• Background in packaging/substrate/PCB technology or related field.
• Track record of driving technology development from concept to qualification.

Responsibilities

• Define and drive packaging technology development for next‑generation Trainium systems, from concept through volume production.
• Collaborate with OSATs and suppliers on validation, test vehicles, qualification, FMEA, and corrective actions.
• Evaluate tradeoffs among performance, cost, yield, warpage, thermal and reliability to guide decisions.
• Represent the packaging technology team in cross‑functional design reviews and program milestones.
• Identify opportunities for novel packaging architectures and process simplifications to reduce cost and accelerate time‑to‑market.

Job description

Annapurna Labs designs silicon and software that accelerate innovation for AI accelerators and cloud solutions. The Packaging Technology Development team leads the packaging, substrate/PCB, interposer, and assembly work for next‑generation Trainium systems, collaborating with silicon, board, system, and supply chain teams to bring bleeding‑edge AI hardware from concept to volume production.

The team seeks engineers who can optimize cost, yield, warpage, and reliability while driving new