Principal Advanced Packaging Engineer - Photonics for AI

Astera Labs; San Jose (CA); On-site; USD 205,000 - 255,000; Full time

Benefits offered by this job

Discretionary bonus

Benefits package

Job summary

Astera Labs is seeking an Advanced Packaging Engineer, Principal in San Jose, CA to lead R&D for next-generation photonics packaging for AI infrastructure. This senior IC packaging role sets technical direction, drives 2.1D/2.5D/3D integration, and guides wafer-, panel-, and die-level packaging flows with OSAT and materials partners.

You will develop packaging PDKs, ensure reliability, and advance EIC-to-PIC integration for NPO/CPO products, reporting to senior technical leadership.

Qualifications

• 8+ years of experience in semiconductor or advanced packaging engineering.
• Strong technical leadership in advanced packaging processes.
• Experience with 2.5D/3D integration, flip-chip, and TSV.
• Experience with silicon photonics chip packaging and EIC/PIC integration.

Responsibilities

• Lead R&D for advanced packaging of optical chips including 2.1D, 2.5D, and 3D integration.
• Define and optimize wafer-, panel-, or die-level packaging flows.
• Drive EIC-to-PIC integration and broader optical device integration efforts.
• Select and qualify packaging materials for advanced packaging.
• Partner with OSAT, tool vendors, and material suppliers on equipment and processes.
• Characterize and improve yield, reliability, and process capability for NPO/CPO.
• Develop and maintain packaging PDKs and design rules.

Skills

Advanced Packaging

Semiconductor Packaging

Photonic Integration

Yield Analysis

Education

B.S./M.S./Ph.D. in Electrical Engineering, Materials Science, Mechanical Engineering

Job description

Astera Labs is seeking an Advanced Packaging Engineer, Principal in San Jose, CA to lead R&D for next-generation photonics packaging for AI infrastructure. This senior IC packaging role sets technical direction, drives 2.1D/2.5D/3D integration, and guides wafer-, panel-, and die-level packaging flows with OSAT and materials partners.

You will develop packaging PDKs, ensure reliability, and advance EIC-to-PIC integration for NPO/CPO products, reporting to senior technical leadership.