Senior Multi‑Die Packaging Engineer for AI Accelerators

Delos Data Inc; Palo Alto (CA); On-site; USD 180,000 - 270,000; Full time

Job summary

Delos Data Inc. is seeking a Senior Packaging Engineer to architect and deliver advanced multi-die IC packages for AI accelerators. You will own package architecture, substrate design, manufacturability, and engage with vendors such as TSMC/OSAT to enable next-gen products.

You will collaborate with IC design and board teams to ensure system-level package requirements are met, evaluate new packaging technologies, and support bring-up, failure analysis, and qualification.

Qualifications

• BS/MS in Electrical Engineering or related field.
• Experience with multi-die package design and UCIe (AP/SP) integration.
• Understanding of substrate materials, stack-ups, and mechanical constraints.
• Familiarity with SI/PI concepts to collaborate with electrical teams.
• Experience managing packaging subcontractors.
• Experience interfacing with TSMC/OSAT for bumping and packaging options.
• Knowledge of package modeling tools (HFSS, Sigrity) is a plus.

Responsibilities

• Select and design optimal multi-die package types (MCM, 2.5D, 3D, fan‑out, CoWoS, InFO, CPC, CPO).
• Define package specifications, bump map and ball map, interposer requirements, mechanical constraints.
• Define substrate stack-ups, bump pitch, routing, vias for performance.

Skills

Multi-die packaging

TSMC/OSAT liaison

Substrate materials

SI/PI concepts

Packaging subcontractors

UCIe integration

Package modeling tools

Education

B.S./M.S. in Electrical Engineering

Tools

HFSS

Sigrity

Job description

Delos Data Inc. is seeking a Senior Packaging Engineer to architect and deliver advanced multi-die IC packages for AI accelerators. You will own package architecture, substrate design, manufacturability, and engage with vendors such as TSMC/OSAT to enable next-gen products.

You will collaborate with IC design and board teams to ensure system-level package requirements are met, evaluate new packaging technologies, and support bring-up, failure analysis, and qualification.