Lead 2.5D/3D Packaging for AI Data Centers

Phizenix Inc.; Santa Clara (CA); Hybrid; USD 180,000 - 200,000; Full time

Job summary

Phizenix Inc. seeks an Advanced 2.5D/3D/Chiplet packaging Lead to direct Signal Integrity for package, PCB and system design for copper interconnects beyond 200G.

Lead 2.5D/3D and heterogeneous packaging development for co-packaged driver, TIA and optical engines, including substrate architecture, interposer evaluation, and die–package co-design. Own OSAT/substrate supplier strategy, PDN and thermal design, and signoff criteria.

Qualifications

• Ph.D. or MS in Electrical Engineering with relevant advanced packaging experience.
• Experience leading teams and delivering products in advanced CMOS nodes.

Responsibilities

• Own SI architecture for 200G+/lane interconnects across package, PCB, and system.
• Lead 2.5D/3D and heterogeneous packaging development with internal teams.
• Drive micro-LED and photonic packaging development.
• Define OSAT strategy, supplier qualification, and HVM readiness.
• Coordinate cross-functional design reviews and risk management.

Skills

SI/PI expertise

2.5D packaging

Cross-functional leadership

OSAT coordination

Thermal/Power integrity

Education

Ph.D. in Electrical Engineering

M.S. in Electrical Engineering

Tools

HFSS

Q3D

SIwave/PowerSI

ADS

Cadence APD/Allegro

Icepak/FloTHERM

Job description

Phizenix Inc. seeks an Advanced 2.5D/3D/Chiplet packaging Lead to direct Signal Integrity for package, PCB and system design for copper interconnects beyond 200G.

Lead 2.5D/3D and heterogeneous packaging development for co-packaged driver, TIA and optical engines, including substrate architecture, interposer evaluation, and die–package co-design. Own OSAT/substrate supplier strategy, PDN and thermal design, and signoff criteria.