Principal Package Engineer

Delos Data Inc; United States; Remote; USD 120,000 - 180,000; Full time

Job summary

Delos Data Inc. seeks an experienced packaging architect to design and deliver advanced multi-die packages for high-performance accelerator systems. You will guide package selection and interconnects from architecture through bring-up and qualification.

You will coordinate with IC design, physical design, and external foundries/OSATs on bumping, stack-ups, and packaging flows, with emphasis on signal and power integrity.

Qualifications

• Experience designing multi-die packages and integrating UCIe.
• Understanding substrate materials, stack-ups, and mechanical constraints.
• Ability to coordinate with suppliers and external packaging partners.

Responsibilities

• Select package approaches (MCM, 2.5D, 3D, fan-out) balancing electrical, thermal, cost, and manufacturability.
• Define package specifications, bump and ball maps, interposer needs, and mechanical constraints.
• Set substrate stack-ups, pitches, routing, via structures, and material choices.
• Design high-speed signal escape and routing, plus package power distribution.
• Coordinate subcontractors and engage foundry/OSAT partners on bumping and packaging flows.
• Work with IC/PD/SI teams; support bring-up, failure analysis, debugging, and qualification.

Skills

Multi-die packages

UCIe integration

Substrate materials knowledge

Signal & power integrity

Subcontractor management

Foundry/OSAT coordination

Education

Bachelor's or Master's in Electrical Engineering

Tools

HFSS

Sigrity

Job description

Role overview

Architect and deliver advanced multi-die packages for high-performance accelerator systems. The work covers package selection, substrate and interconnect definition, signal and power routing, manufacturability, and coordination with design teams and external packaging partners from architecture through bring-up and qualification.

Responsibilities

• Select package approaches, such as MCM, 2.5D, 3D, fan-out, or other advanced options, balancing electrical and thermal performance, cost, and manufacturability.
• Define package specifications, bump and ball maps, interposer needs, and mechanical constraints.
• Set substrate stack-ups, pitches, routing, via structures, and material choices.
• Design high-speed signal escape and routing, along with package power distribution.
• Coordinate subcontractors and engage foundry or assembly partners on bumping, substrate choices, and packaging flows.
• Work with IC design, physical design, SI/PI, and board teams; support package bring-up, failure analysis, debugging, and qualification.

Requirements

• Bachelor’s or master’s degree in electrical engineering or a related field.
• Experience designing multi-die packages and integrating UCIe, including advanced or standard package interfaces.
• Understanding of substrate materials, stack-ups, and mechanical constraints.
• Familiarity with signal- and power-integrity concepts sufficient to work with electrical design teams.
• Experience managing packaging subcontractors and coordinating with foundry or OSAT partners on bumping and package options.

Nice to have

• Experience with package modeling tools such as HFSS, Sigrity, or similar.