Principal Engineer - 2.5D/3D Package Design

QUALCOMM, Inc.; San Diego (CA); On-site; USD 210,000 - 315,000; Full time

Benefits offered by this job

Bonus program

RSU grants

Competitive benefits

Job summary

Qualcomm Technologies, Inc. in San Diego, CA, seeks a Principal Engineer to build and lead a 2.5D/3D Advanced Package Design team for HPC and Datacenter products.

You will own scalable design methodologies, flows, and production‑quality signoff for multi‑die packages, collaborating with foundries, EDA vendors, OSATs, and internal teams. The ideal candidate combines hands‑on interposer, chiplet, HBM, and substrate design expertise with a successful track record building and growing engineering

Qualifications

• Proven track record of leading advanced package design teams.
• Deep expertise in 2.5D/3D integration and HBM/chiplet architectures.
• Experience deploying production 2.5D/3D design flows and signoff.
• Strong collaboration with foundries, OSATs, and EDA vendors.

Responsibilities

• Build and grow a high‑performing 2.5D/3D package design team.
• Own strategy, roadmap, and deployment of end‑to‑end design flows.
• Develop scalable flows for die/chiplet assembly, floorplanning, and interposer design.
• Lead 2.5D/3D package implementations using interposers, bridges, and HBMs.
• Align toolchains with Cadence, Siemens EDA, Synopsys, and others; ensure repeatability.

Skills

Advanced packaging design

3DIC

EDA tools experience

Leadership

Communication

Education

Bachelor's in Electrical/Mechanical/Chemical Eng

Master's or PhD preferred

Tools

Cadence

Siemens EDA

Synopsys

Ansys

3DIC tools

Job description

Qualcomm Technologies, Inc. in San Diego, CA, seeks a Principal Engineer to build and lead a 2.5D/3D Advanced Package Design team for HPC and Datacenter products.

You will own scalable design methodologies, flows, and production‑quality signoff for multi‑die packages, collaborating with foundries, EDA vendors, OSATs, and internal teams. The ideal candidate combines hands‑on interposer, chiplet, HBM, and substrate design expertise with a successful track record building and growing engineering