Packaging R&D Engineer - Advanced Substrate Tech

Intel Corporation; Phoenix (AZ); On-site; USD 134,000 - 189,000; Full time

Job summary

Intel Corporation in Phoenix, AZ seeks a Packaging Research and Development Engineer for Substrate Packaging Technology Development (SPTD). You will lead process and material development to scale advanced substrate packaging technology, spend significant time on the factory floor, and collaborate with equipment suppliers.

The role requires a Master’s degree with 3+ years of related experience or a PhD with 1+ year, plus hands-on experience in packaging/manufacturing. Willingness to travel <5% and strong cross-functional collaboration are essential.

Qualifications

• Master's degree in engineering or science with 3+ years related experience, or PhD with 1+ year.
• Experience in mechanical and materials engineering, DOE, and process development.
• Experience in semiconductor packaging and factory operations.
• Strong communication and collaboration with suppliers.

Responsibilities

• Define and establish equipment configurations, process specifications, and integrated process flow for new technologies.
• Plan and conduct DOEs to characterize process windows and interactions.
• Lead continuous improvements on process capability, quality, cost, and productivity.
• Lead cross-functional teams to support substrate technology development.

Skills

DOE

Statistical analysis

Process development

Root cause investigation

Python

Machine learning

JMP

JSL

DSC

TGA

D/TMA

Titration

ICP-MS

FTIR

XPS

TOF-SIMS

EDX

SEM

Education

Master's degree in Engineering/Science

PhD in Engineering/Science

Tools

DSC

TGA

D/TMA

ICP-MS

FTIR

XPS

TOF-SIMS

EDX

SEM

Job description

Intel Corporation in Phoenix, AZ seeks a Packaging Research and Development Engineer for Substrate Packaging Technology Development (SPTD). You will lead process and material development to scale advanced substrate packaging technology, spend significant time on the factory floor, and collaborate with equipment suppliers.

The role requires a Master’s degree with 3+ years of related experience or a PhD with 1+ year, plus hands-on experience in packaging/manufacturing. Willingness to travel <5% and strong cross-functional collaboration are essential.