Lead, Substrate Supplier Enablement for Advanced Packaging

Intel Corporation

Chandler (AZ)

On-site

USD 164,000 - 232,000

Full time

3 days ago

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Benefits offered by this job

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Health benefits

Retirement plan

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Job summary

Intel Corporation in the United States (Arizona, Phoenix) seeks an experienced engineer to lead substrate technology development and supplier readiness for advanced packaging programs such as high density FCBGA, EMIB-T, and glass core substrate.

You will drive process integration roadmaps, perform data-driven yield analysis, and manage supplier performance with cross-functional teams across Intel. Occasional travel to supplier sites and East Asia will be required.

Qualifications

Bachelor's degree with 9+ years of relevant experience.
Master's degree with 6+ years of relevant experience.
PhD with 4+ years of relevant experience.
Experience in process integration methodologies and tools used in semiconductor manufacturing environments.
Experience in advanced packaging, substrates, or semiconductor process development.

Responsibilities

Define process integration roadmaps and establish manufacturing procedures to meet technology transfer milestones.
Extract insights from structured and unstructured data, applying statistical analysis and coding techniques for yield improvement.
Lead low yield analysis and corrective actions to address quality excursions in high-volume production environments.
Drive continuous improvement initiatives to minimize defects and optimize process reliability.
Assess quality and reliability risks for manufacturing material and process changes, ensuring sustained product performance.
Collaborate with internal teams and external stakeholders to align process strategies with program goals.