Packaging Research and Development Engineer

Intel Corporation; Phoenix (AZ); On-site; USD 134,000 - 189,000; Full time

Job summary

Intel Corporation in Phoenix, AZ seeks a Packaging Research and Development Engineer for Substrate Packaging Technology Development (SPTD). You will lead process and material development to scale advanced substrate packaging technology, spend significant time on the factory floor, and collaborate with equipment suppliers.

The role requires a Master’s degree with 3+ years of related experience or a PhD with 1+ year, plus hands-on experience in packaging/manufacturing. Willingness to travel <5% and strong cross-functional collaboration are essential.

Qualifications

• Master's degree in engineering or science with 3+ years related experience, or PhD with 1+ year.
• Experience in mechanical and materials engineering, DOE, and process development.
• Experience in semiconductor packaging and factory operations.
• Strong communication and collaboration with suppliers.

Responsibilities

• Define and establish equipment configurations, process specifications, and integrated process flow for new technologies.
• Plan and conduct DOEs to characterize process windows and interactions.
• Lead continuous improvements on process capability, quality, cost, and productivity.
• Lead cross-functional teams to support substrate technology development.

Skills

DOE

Statistical analysis

Process development

Root cause investigation

Python

Machine learning

JMP

JSL

DSC

TGA

D/TMA

Titration

ICP-MS

FTIR

XPS

TOF-SIMS

EDX

SEM

Education

Master's degree in Engineering/Science

PhD in Engineering/Science

Tools

DSC

TGA

D/TMA

ICP-MS

FTIR

XPS

TOF-SIMS

EDX

SEM

Job description

Job Details

Job Description: Substrate Packaging Technology Development (SPTD) is looking for a Packaging Research and Development Engineer to join the Module Engineering Backend Area specifically to be in charge of process and material development to scale advanced substrate packaging technology to enable further die disaggregation / heterogenous integration. This position requires most of time spent on the factory floor and/or interacting with equipment/material suppliers. The candidate will join and become part of a world class first of a kind embedded die packaging facility, learn advanced substrate manufacturing know-how, drive disruptive technology innovations, and be part of creating history in the substrate packaging industry.

Responsibilities Will Include But Not Be Limited To

• Define and establish equipment configurations, process specifications, and integrated process flow for new process technologies
• Plan and conduct comprehensive DOEs to fundamentally characterize process window, and understand process / equipment / materials interactions
• Drive continuous process improvements on process capability/stability, quality/reliability, cost/yield, automation, and productivity
• Lead and participate in cross-functional and cross-organizational teams or work groups that support substrate technology development.

The ideal candidate should exhibit the following behavioral traits and/or skills:

• Written and verbal communication and teamwork skills.
• Interact with equipment and materials suppliers.
• Willingness to travel (some travel may be required, less than 5 percent)
• Work with ambiguity and flexibility with respect to job roles and working hours is required.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates. Knowledge and/or experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum Qualifications

• Master's degree in a relevant science or engineering discipline, preferably Mechanical Engineering, Chemical Engineering, Materials Science, Physics, or Chemistry, with 3+ years of related experience; or
• PhD degree in a relevant science or engineering discipline, preferably Mechanical Engineering, Chemical Engineering, Materials Science, Physics, or Chemistry, with 1+ year of related experience.

Experience listed below should be in any of the following:

• Mechanical & Materials Engineering: Solid background in mechanical and materials engineering, with experience applying materials characterization, mechanical design principles, reliability assessments, and failure analysis to support advanced packaging and manufacturing technology development.
• Advanced Packaging & Manufacturing Development: Experience developing semiconductor packaging, substrate, embedded die, or heterogeneous integration technologies, including hands‑on work with process equipment, factory operations, and equipment suppliers.
• Process Characterization & Optimization: Expertise in DOE, statistical analysis, process development, root cause investigation, and driving improvements in yield, reliability, quality, and process capability.

Preferred Qualifications

1+ years of experience in the following:

• Research & Innovation Experience: Experience conducting research in semiconductor packaging, materials, manufacturing processes, or related fields
• Engineering troubleshooting and analytical skills on integrated technology issues and experience working with broad team of other process and integration engineers.
• Experience owning process tools with knowledge of SPC PCS RFCs equipment troubleshooting statistical design of experiments and process development.
• Experience working with a variety of organic/inorganic materials and processes as well as characterizations utilizing techniques such as DSC, TGA, D/TMA, Titration, ICPMS, FTIR, XPS, TOFSIMS, EDX, SEM, etc. is highly desirable.
• Experience with statistical data analysis, JMP and JSL, Python, relational database structure and usage, machine learning.

Job Type

Experienced Hire

Shift

Shift 1 (United States of America)

Primary Location: US, Arizona, Phoenix

Additional Locations:

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $133,800.00 - 188,890.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during your hiring process, please report this immediately to your recruiter.