Advanced Packaging Substrate Supplier Enablement Lead

Intel Corporation; Chandler (AZ); On-site; USD 164,000 - 232,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Vacation

Job summary

Intel Corporation in the United States (Arizona, Phoenix) seeks an experienced engineer to lead substrate technology development and supplier readiness for advanced packaging programs such as high density FCBGA, EMIB-T, and glass core substrate.

You will drive process integration roadmaps, perform data-driven yield analysis, and manage supplier performance with cross-functional teams across Intel. Occasional travel to supplier sites and East Asia will be required.

Qualifications

• Bachelor's degree with 9+ years of relevant experience.
• Master's degree with 6+ years of relevant experience.
• PhD with 4+ years of relevant experience.
• Experience in process integration methodologies and tools used in semiconductor manufacturing environments.
• Experience in advanced packaging, substrates, or semiconductor process development.

Responsibilities

• Define process integration roadmaps and establish manufacturing procedures to meet technology transfer milestones.
• Extract insights from structured and unstructured data, applying statistical analysis and coding techniques for yield improvement.
• Lead low yield analysis and corrective actions to address quality excursions in high-volume production environments.
• Drive continuous improvement initiatives to minimize defects and optimize process reliability.
• Assess quality and reliability risks for manufacturing material and process changes, ensuring sustained product performance.
• Collaborate with internal teams and external stakeholders to align process strategies with program goals.

Skills

Process integration

Advanced packaging

Substrates

Semiconductor process development

Data analysis

Education

Bachelor's degree in engineering, physics, materials science, or related field

Master's degree in engineering, physics, materials science, or related field

PhD in engineering, physics, materials science, or related field

Job description

Job Details: Job Description: The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization is responsible for developing cutting edge substrate packaging and wafer assembly solutions for our customers. As a member of the Substrate Technology and Manufacturing Group, you will play a critical role in enabling new manufacturing capacity across advanced packaging suppliers. In this position, you will lead substrate supplier development and qualification activities for advanced technologies such as high density FCBGA, EMIB-T and glass core substrate, ensuring suppliers achieve the required readiness to support growing customer demand. This includes driving technical enablement, managing readiness milestones, and collaborating closely with cross functional engineering teams and supplier partners. A combination of detail-oriented project management, strong technical risk assessment / problem solving skills, and effective supplier / stakeholder management will be needed to be successful. Please note: This role requires periodic evening meetings with suppliers in East Asia, as well as occasional travel to supplier sites to support essential program objectives.

Key Responsibilities

• Define process integration roadmaps and establish manufacturing procedures to meet technology transfer milestones.
• Extract insights from structured and unstructured data, applying statistical analysis and coding techniques for yield improvement.
• Lead low yield analysis and corrective actions to address quality excursions in high-volume production environments.
• Drive continuous improvement initiatives to minimize defects and optimize process reliability.
• Assess quality and reliability risks for manufacturing material and process changes, ensuring sustained product performance.
• Collaborate with internal teams and external stakeholders to align process strategies with program goals.

Behavioral traits

• Demonstrated expertise in structured problem solving and data-driven decision-making.
• Proven leadership in supplier management and technology enablement.
• Strong collaboration, influencing, and communication skills across global, cross-functional teams.
• Strategic mindset with the ability to align technical solutions with organizational objectives.
• Enthusiasm for innovation, mentoring, and contributing to Intel's technical leadership.

Qualifications

• Minimum Qualifications Bachelor's degree in engineering, physics, materials science, or a related field, with 9+ years of relevant experience.
• or Master's degree in engineering, physics, materials science, or a related field, with 6+ years of relevant experience.
• or PhD in engineering, physics, materials science, or a related field, with 4+ years of relevant experience.
• The experience listed above should be a combination of the following: Proficiency in process integration methodologies and tools used in semiconductor manufacturing environments.
• Experience in advanced packaging, substrates, or semiconductor process development.

Job Type & Shift

Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations:

Position of Trust

N/A

Benefits

• We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
• Find out more about the benefits of working at Intel.

Annual Salary Range

Annual Salary Range for jobs which could be performed in the US: $164,100.00-231,670.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

• This role will require an on-site presence.
• * Job posting details (such as work model, location or time type) are subject to change.
• * ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter. Intel’s official careers website.