Packaging Module Engineer: DOE‑Driven Innovation & Reliability

Intel Corporation; Phoenix, Northern (AZ, KY); Hybrid; USD 115,000 - 163,000; Full time

Benefits offered by this job

Competitive pay

Stock bonuses

Benefits package

Job summary

Intel Corporation's Packaging Module Development team is seeking a Packaging Module Development Engineer to design and optimize processes and equipment that support Intel's roadmap for next‑generation packaging solutions.

You will contribute to manufacturing efficiency, product reliability, and technology advancement by applying DOE, SPC, and design for manufacturability across packaging platforms.

Qualifications

• Bachelor's degree in Mechanical Eng, Materials Science, Metallurgical Eng, or related STEM with 3+ years of experience.
• Master's degree with 2+ years of relevant experience.
• PhD with 6+ months of relevant experience.
• Proficiency in SPC and DOE principles.
• Familiarity with mechanical drawings and GD&T.
• Competency in SolidWorks or AutoCAD.

Responsibilities

• Develop and refine packaging processes and equipment to achieve targets.
• Apply DOE and SPC to optimize processes; document findings.
• Design and maintain equipment to test packaging under heat, humidity, cycles.
• Ensure manufacturability of layouts and manage manufacturing workflows.
• Define material specifications with supplier QA and procurement.
• Lead continuous improvement and provide expert consultation.

Skills

SPC & DOE

Drawings & GD&T

SolidWorks

AutoCAD

Education

Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or related STEM with 3+ years

Master's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or related STEM with 2+ years

PhD in Mechanical Engineering, Materials Science, Metallurgical Engineering, or related STEM with 6+ month experience

Tools

SolidWorks

AutoCAD

Job description

Intel Corporation's Packaging Module Development team is seeking a Packaging Module Development Engineer to design and optimize processes and equipment that support Intel's roadmap for next‑generation packaging solutions.

You will contribute to manufacturing efficiency, product reliability, and technology advancement by applying DOE, SPC, and design for manufacturability across packaging platforms.