Packaging Module Engineer — Innovate & Optimize Assembly

Intel Corporation; Chandler (AZ); On-site; USD 115,110 - 219,550; Full time

Benefits offered by this job

Competitive pay

Stock bonuses

Health benefits

Retirement plans

Vacation time

Job summary

Intel Corporation is looking for a highly skilled engineer to develop and optimize assembly processes for future technologies. Located in Chandler, Arizona, the role involves ensuring the manufacturability of package designs while collaborating closely with supplier quality teams.

The ideal candidate will possess a Master’s or PhD in Mechanical Engineering or a related field, with at least 3 years of relevant experience. The position offers a robust compensation package including competitive pay and stock bonuses.

Qualifications

• 3+ years of experience in relevant fields or similar experience with a PhD.
• Experience in programming and semiconductor processes.
• Preferred: Familiarity with SPC, DOE, AI, and ML concepts.

Responsibilities

• Develop innovative assembly processes and equipment.
• Optimize manufacturing efficiency and quality.
• Ensure manufacturability and oversee packaging processes.

Skills

Programming (Python, MATLAB)

Semiconductor fabrication processes

Statistical Process Control (SPC)

Design of Experiments (DOE)

Artificial Intelligence

Machine Learning

Education

Master’s degree in Mechanical Engineering or related field

PhD in Mechanical Engineering or related field

Job description

Intel Corporation is looking for a highly skilled engineer to develop and optimize assembly processes for future technologies. Located in Chandler, Arizona, the role involves ensuring the manufacturability of package designs while collaborating closely with supplier quality teams.

The ideal candidate will possess a Master’s or PhD in Mechanical Engineering or a related field, with at least 3 years of relevant experience. The position offers a robust compensation package including competitive pay and stock bonuses.