Night Shift Module Engineer – Packaging & Reliability

3M HEALTHCARE

Phoenix (AZ)

On-site

USD 99,030 - 139,810

Full time

14 days+
Application generator

Stand out for this role — generate a tailored resume and cover letter in about a minute.

Get past ATS filters

Benefits offered by this job

Stock bonuses
Health benefits
Retirement plan
Vacation

Job summary

3M HEALTHCARE in Phoenix, AZ seeks an Experienced Packaging Engineer to lead development of assembly processes and equipment aligned with Intel-like roadmap ambitions. The role requires onsite presence and involves optimizing packaging manufacturing to achieve high quality, reliability, and cost targets.

Minimum qualifications include a Bachelor's degree in a STEM field and at least 1 year of manufacturing or engineering experience, plus 6 months experience with SPC and DOE.

Qualifications

  • Requires manufacturing or engineering experience.
  • Familiarity with SPC and DOE principles.
  • Strong problem‑solving and data analysis skills.

Responsibilities

  • Develop assembly processes and equipment for future packaging platform technologies.
  • Optimize manufacturing package efficiency to meet quality, cost, yield, and productivity goals.
  • Define process specifications and document improvements with data analysis and white papers.
  • Maintain equipment to evaluate silicon and package tech under simulated field conditions (heat, humidity, temp cycles).
  • Ensure manufacturability of package layouts and oversee process flows and cycles.
  • Set material specs for contract assemblers and interface with suppliers to ensure quality and vendor performance.

Skills

SPC
DOE
Manufacturing experience

Education

Bachelor's degree in engineering or STEM
Master’s degree preferred

Job description

3M HEALTHCARE in Phoenix, AZ seeks an Experienced Packaging Engineer to lead development of assembly processes and equipment aligned with Intel-like roadmap ambitions. The role requires onsite presence and involves optimizing packaging manufacturing to achieve high quality, reliability, and cost targets.

Minimum qualifications include a Bachelor's degree in a STEM field and at least 1 year of manufacturing or engineering experience, plus 6 months experience with SPC and DOE.

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Packaging Process Engineer Onsite: Innovation & Reliability
Packaging Process Engineer Onsite: Innovation & Reliability

Intel • Phoenix (AZ)

On-site
USD 134,000 - 189,000
Stock bonuses
Health insurance
Retirement plan
+1
Night Shift Module Engineer — Semiconductor Packaging
Night Shift Module Engineer — Semiconductor Packaging

Intel Corporation • Phoenix (AZ), Northern (KY)

Hybrid
USD 99,000 - 140,000
Competitive pay
Stock bonuses
Health benefits
+2
JR0283734 Module Engineer on Night Shift 6
JR0283734 Module Engineer on Night Shift 6

3M HEALTHCARE • Phoenix (AZ)

On-site
USD 99,030 - 139,810
Stock bonuses
Health benefits
Retirement plan
+1
Packaging Media & Collateral Engineer for Reliability
Packaging Media & Collateral Engineer for Reliability

Intel Corporation • Phoenix (AZ)

On-site
USD 85,000 - 120,000
Stock bonuses
Health benefits
Vacation
Packaging Module Development Engineer
Packaging Module Development Engineer

Intel • Phoenix (AZ)

On-site
USD 134,000 - 189,000
Stock bonuses
Health insurance
Retirement plan
+1
Packaging Module Engineer: DOE‑Driven Innovation & Reliability
Packaging Module Engineer: DOE‑Driven Innovation & Reliability

Intel Corporation • Phoenix (AZ), Northern (KY)

Hybrid
USD 115,000 - 163,000
Competitive pay
Stock bonuses
Benefits package
Module Engineer On Shift — 24x7 Semiconductor Packaging
Module Engineer On Shift — 24x7 Semiconductor Packaging

Intel Corporation • Phoenix (AZ), Northern (KY)

Hybrid
USD 99,000 - 140,000
Stock bonuses
Health benefits
Retirement plan
+1
Packaging Media & Collateral Innovation Engineer
Packaging Media & Collateral Innovation Engineer

Intel Corporation • Phoenix (AZ), Northern (KY)

Hybrid
USD 85,000 - 120,000
Health insurance
Stock bonuses
Retirement plan
+1
Media & Collateral Packaging Engineer
Media & Collateral Packaging Engineer

Intel • Phoenix (AZ)

On-site
USD 85,000 - 120,000
Stock bonuses
Health benefits
Retirement plan
+1
Packaging Process Engineer – Advanced Semiconductors
Packaging Process Engineer – Advanced Semiconductors

Intel Corporation • Phoenix (AZ), Northern (KY)

Hybrid
USD 115,000 - 220,000
Stock bonuses
Health benefits
Vacation