Laser Packaging Development Engineer

Intel; Phoenix (AZ); On-site; USD 85,000 - 163,000; Full time

Benefits offered by this job

Competitive pay

Stock bonuses

Health and retirement benefits

Vacation

Job summary

Intel is seeking a Packaging Module Development Engineer in Laser Assembly based in Phoenix, AZ. You will design laser-assisted packaging processes, optimize performance, and collaborate across teams to advance next-generation semiconductor packaging.

The role emphasizes DOE-driven process development, data analysis, and ensuring manufacturability and reliability of packaging solutions in a fast-paced environment.

Qualifications

• Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
• Fundamental understanding of laser and optical systems.
• Hands-on experience in a technology manufacturing environment or semiconductor packaging processes and troubleshooting laser based equipment/systems.
• Familiarity with equipment adjustment, process characterization, and manufacturability in semiconductor or electronics assembly.
• Ability to apply Data Science and Statistics tools (Python, Numpy/Pandas, SQL, JMP, Minitab) to manipulate large complex data sets.

Responsibilities

• Design and develop laser assembly packaging processes and equipment to enable next-generation packaging technologies.
• Optimize manufacturing processes to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
• Develop process and equipment specifications using DOE and data analysis principles.
• Oversee the manufacturability of physical layout designs and manage full packaging process cycles.
• Establish laser process specifications and collaborate with suppliers to meet quality and performance standards.
• Innovate techniques, tools, and quality screens for early identification of packaging quality and reliability issues.
• Set laser process reliability requirements influencing design, material selection, and process development.
• Drive standardization in qualification procedures, manufacturing quality systems, and processes with engineering teams.

Skills

Statistical Process Control

Design of Experiments

Laser/Optical knowledge

Data analysis tools

Cross-functional collaboration

Education

Bachelor's degree in Physics/ME/Optical Engineering or related STEM field

Master's degree in Physics/ME/Optical Engineering or related STEM field

Tools

Python

NumPy/Pandas

SQL

JMP

Minitab

Job description

Intel is seeking a Packaging Module Development Engineer in Laser Assembly based in Phoenix, AZ. You will design laser-assisted packaging processes, optimize performance, and collaborate across teams to advance next-generation semiconductor packaging.

The role emphasizes DOE-driven process development, data analysis, and ensuring manufacturability and reliability of packaging solutions in a fast-paced environment.