Packaging Reliability Lab Engineer: Advanced Packaging Tech

Intel

Phoenix (AZ)

On-site

USD 133,800 - 188,890

Full time

14 days+

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Benefits offered by this job

Stock bonuses

Health benefits

On-site role

Job summary

Intel’s Stress Testing and Reliability Laboratory seeks an experienced engineer to join the Environmental Stress Tool Engineering team in Arizona. You will advance packaging technologies (EMIB, Foveros, Hybrid Bonding, Co‑Packaged Optics) and support qualification and development efforts, operating advanced stress systems to produce reliable data for process decisions.

The role emphasizes integration of measurement, automation, and calibration, with collaboration across operations, planning, and

Qualifications

Master's degree in Electrical Engineering or related field with 3+ years of experience
PhD in Electrical Engineering or related field
Experience with DC electrical systems, including operation, troubleshooting, and calibration of programmable DC power supplies and instrumentation
Experience with electrical measurement and data acquisition equipment (DMMs, thermocouple systems, temperature monitoring hardware)
Familiarity with data acquisition systems, protocols (GEM 300, Ethernet, GPIB, RS-232), and automated test equipment
Experience with LabVIEW, Python, JMP, SQL for measurement, control, and data analysis

Responsibilities

Characterization of equipment performance and response to excursions/issues
Continuous improvement of methods, specifications, and training
Development, analysis, and implementation of statistical process control
Translation of reliability stress analysis requirements into fixturing and development of new tools and systems
Coordination of tool vendors and field service engineers
Collaboration with internal operations, planning, and facilities teams