Packaging Module Development Engineer: Innovate & Optimize

Intel; Phoenix (AZ); On-site; USD 115,110 - 188,890; Full time

Benefits offered by this job

Competitive pay

Stock bonuses

Health, retirement, and vacation

Job summary

Intel’s Packaging Module Development team seeks a Packaging Module Development Engineer to design and optimize processes and equipment for next‑gen packaging solutions. You will drive DOE studies, reliability benchmarking, and manufacturability improvements to boost efficiency and product quality.

You will collaborate with cross‑functional teams to align with roadmaps, lead technical investigations, and implement innovative quality screens to address packaging challenges across Intel’s

Qualifications

• Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 3+ years of relevant experience.
• -OR- Master's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 2+ years of relevant experience.
• -OR- PhD in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 6+ month of relevant experience.

Responsibilities

• Develop and refine packaging processes and equipment to achieve quality, reliability, cost, yield, productivity, and manufacturability targets.
• Apply Design of Experiments (DOE) principles and statistical methodologies to optimize processes and specifications, documenting findings through technical reports.
• Design and maintain equipment to evaluate packaging technologies under simulated field conditions, such as heat, humidity, temperature cycles, and dynamic forces.
• Ensure manufacturability of physical layouts in package design and oversee the lifecycle of manufacturing workflows.
• Define material specifications and collaborate with supplier quality and procurement teams to ensure compliance with quality and performance benchmarks.
• Innovate new techniques, tools, and quality screens to proactively identify and mitigate packaging reliability challenges.
• Set reliability benchmarks based on a thorough understanding of failure mechanisms to meet customer needs.
• Lead problem‑solving initiatives and drive continuous improvement in equipment and processes.
• Provide expert consultation to internal teams and partners on packaging challenges and technical solutions.
• Standardize product qualification practices and manufacturing quality systems while managing technical risks aligned with product milestones.

Skills

SPC

DOE

Mechanical drawings

Geometric Dimensioning and Tolerancing

SolidWorks

AutoCAD

Education

Bachelor's degree in Mechanical Engineering|Materials Science|Metallurgical Engineering|related STEM field

Master's degree in Mechanical Engineering|Materials Science|Metallurgical Engineering|related STEM field

PhD in Mechanical Engineering|Materials Science|Metallurgical Engineering|related STEM field

Tools

SolidWorks

AutoCAD

Job description

Intel’s Packaging Module Development team seeks a Packaging Module Development Engineer to design and optimize processes and equipment for next‑gen packaging solutions. You will drive DOE studies, reliability benchmarking, and manufacturability improvements to boost efficiency and product quality.

You will collaborate with cross‑functional teams to align with roadmaps, lead technical investigations, and implement innovative quality screens to address packaging challenges across Intel’s