Packaging Reliability Lab Engineer for Next‑Gen Tech

Intel Corporation; Chandler (AZ); On-site; USD 134,000 - 189,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Job summary

Intel Corporation in Phoenix, Arizona, is seeking a hands-on engineer for the Environmental Stress Tool Engineering team to advance packaging technologies such as EMIB, Foveros, Hybrid Bonding, and Co-Packaged Optics.

You will support equipment with DC power and measurement systems, study reliability stress requirements, and collaborate with vendors and internal teams to develop new tools and fixtures for robust qualification and process development.

Qualifications

• Master's degree in Electrical Engineering or a related scientific field with 3+ years of experience.
• PhD in Electrical Engineering or a related scientific field with 0 years of experience.

Responsibilities

• Characterization of equipment performance and response to excursions/issues
• Continuous improvement of methods, specifications, and training
• Development, analysis, and implementation of statistical process control
• Translation of reliability stress analysis requirements into fixturing and development of new tools, systems, and other innovative solutions
• Coordination of tool vendors and field service engineers
• Collaboration with internal operations, planning, and facilities teams

Skills

DC electrical systems understanding

Electrical measurement and data‑acquis

Scripting/automation

Education

Master's degree in Electrical Engineering or related field

PhD in Electrical Engineering or related field

Tools

LabVIEW

Python

JMP

SQL

GPIB/RS-232/Ethernet protocols

DAQ systems

Job description

Intel Corporation in Phoenix, Arizona, is seeking a hands-on engineer for the Environmental Stress Tool Engineering team to advance packaging technologies such as EMIB, Foveros, Hybrid Bonding, and Co-Packaged Optics.

You will support equipment with DC power and measurement systems, study reliability stress requirements, and collaborate with vendors and internal teams to develop new tools and fixtures for robust qualification and process development.