Packaging Engineer: Media, Collaterals & Processes (Onsite)

Intel; Phoenix (AZ); On-site; USD 85,000 - 120,000; Full time

Job summary

Intel seeks an experienced engineer in Phoenix to develop assembly processes and equipment for next‑generation packaging. You will optimize package manufacturing to meet quality, reliability, cost, yield, and productivity targets, and define specifications using DOE and SPC methods.

The role requires strong CAD skills in SolidWorks and AutoCAD, plus a portfolio of projects from concept to fabrication. On-site work in Phoenix is expected.

Qualifications

• Bachelor’s degree in mechanical engineering, materials engineering, electrical engineering or physics (or a related field).
• Master’s degree in mechanical engineering, materials engineering, electrical engineering or physics is a plus.
• Minimum 6 months of experience applying SPC and DOE principles to develop novel solutions.

Responsibilities

• Develops assembly processes and equipment to enable Intel’s roadmap for future packaging platform technologies.
• Optimizes manufacturing of packages to meet quality, reliability, cost, yield, and productivity requirements.
• Develops process/equipment specifications and documents improvements with DOE and data analysis.

Skills

SPC

DOE

Mechanical design

Education

Bachelor's in mechanical engineering/Materials/Electrical/Physics

Master’s in mechanical engineering/Materials/Electrical/Physics

Tools

SolidWorks

AutoCAD

Job description

Intel seeks an experienced engineer in Phoenix to develop assembly processes and equipment for next‑generation packaging. You will optimize package manufacturing to meet quality, reliability, cost, yield, and productivity targets, and define specifications using DOE and SPC methods.

The role requires strong CAD skills in SolidWorks and AutoCAD, plus a portfolio of projects from concept to fabrication. On-site work in Phoenix is expected.