Laser Packaging Development Engineer - DOE & SPC

Intel Corporation; Chandler (AZ); On-site; USD 85,000 - 163,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Vacation

Job summary

Intel Corporation in Arizona seeks a Packaging Module Development Engineer in Laser Assembly to shape the future of semiconductor packaging technologies. You will contribute to development of processes and equipment that ensure high performance and reliability across Intel's assembly and packaging solutions.

Collaborate with cross-functional teams to design laser assembly packaging processes, optimize manufacturing, set DOE-based specs, and drive standardization in qualification and quality

Qualifications

• Degree in Physics, Mechanical or Optical Engineering or related STEM field.
• Experience with SPC/DOE methods and data analysis basics.
• Understanding of laser/optical systems and their impact on packaging.

Responsibilities

• Design and develop laser assembly packaging processes and equipment.
• Optimize manufacturing to meet quality, cost, yield and productivity targets.
• Develop process specifications using DOE and data analysis.
• Oversee manufacturability of layout designs and packaging flows.
• Establish laser process specs and collaborate with suppliers.
• Innovate techniques and quality screens for early failure detection.
• Drive standardization in qualification procedures and quality systems.

Skills

SPC & DOE

Laser/Optical fundamentals

Cross-functional collaboration

Education

Bachelor’s degree in Physics, Mechanical Engineering, Optical Engineering or related STEM field

Master’s degree in Physics, Mechanical Engineering, Optical Engineering or related STEM field

Tools

Python

Numpy/Pandas

SQL

JMP

Minitab

Job description

Intel Corporation in Arizona seeks a Packaging Module Development Engineer in Laser Assembly to shape the future of semiconductor packaging technologies. You will contribute to development of processes and equipment that ensure high performance and reliability across Intel's assembly and packaging solutions.

Collaborate with cross-functional teams to design laser assembly packaging processes, optimize manufacturing, set DOE-based specs, and drive standardization in qualification and quality