Semiconductor Packaging Equipment Development Leader

Intel Corporation; Chandler (AZ); On-site; USD 181,000 - 255,000; Full time

Benefits offered by this job

Competitive pay

Stock bonuses

Health benefits

Job summary

Intel Corporation in Chandler, AZ seeks an experienced Packaging Equipment Development Manager to lead a team delivering advanced semiconductor packaging equipment and processes. You will manage new equipment introductions, coordinate development with high-volume manufacturing, and mentor engineers to drive world-class solutions.

Join Intel’s Assembly Technology Development organization to shape future packaging capabilities, collaborate with suppliers and internal stakeholders, and ensure

Qualifications

• Bachelor’s degree in Materials Science, Mechanical Engineering, Physics, Electrical Engineering, Chemical Engineering or related field with 9+ years of relevant experience.
• Master’s degree in the above fields with 6+ years of relevant experience.
• PhD degree in the above fields with 4+ years of relevant experience.
• Demonstrated experience in equipment development and process integration for semiconductor packaging.
• Proficiency in statistical methods, experimental design, and data analysis.

Responsibilities

• Lead a team responsible for equipment development, driving innovative solutions for semiconductor packaging.
• Drive first of kind equipment introduction, development and ensure smooth transitions between development and high-volume manufacturing (HVM).
• Manage strategic and tactical decision-making for module engineering activities, ensuring alignment with Intel’s operational goals.
• Collaborate with internal and external stakeholders, including manufacturing, automation, equipment suppliers, and process integration teams, to optimize equipment, processes and solve technical challenges.
• Develop long-term strategies for equipment capabilities to support future requirements.
• Provide mentorship to engineers, fostering technical expertise and leadership within the team.
• Ensure team accountability and drive results through effective goal setting, performance management, and collaboration.
• Champion Intel’s values, creating an inclusive and productive work environment.

Skills

Statistical methods

Experimental design

Data analysis

Leadership

Project management

Education

Bachelor’s degree (relevant field)

Master’s degree (relevant field)

PhD (relevant field)

Job description

Intel Corporation in Chandler, AZ seeks an experienced Packaging Equipment Development Manager to lead a team delivering advanced semiconductor packaging equipment and processes. You will manage new equipment introductions, coordinate development with high-volume manufacturing, and mentor engineers to drive world-class solutions.

Join Intel’s Assembly Technology Development organization to shape future packaging capabilities, collaborate with suppliers and internal stakeholders, and ensure