Module Engineer - High-Volume IC Manufacturing

100 Intel Corporation; Oregon; On-site; USD 76,000 - 146,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Vacation

Job summary

Intel Corporation's Wafer Packaging Manufacturing (WPM) C4 OR group in Hillsboro, OR is seeking a Module Engineer to own high‑volume manufacturing equipment and processes, perform tests and optimizations, and drive safety, quality, and productivity improvements on the production line.

You will lead excursions, tool qualification during ramps, participate in technology transfer, and collaborate with suppliers and global teams to ensure consistent, world-class silicon manufacturing.

Qualifications

• Bachelor's degree in Engineering STEM field with 6+ months of experience in equipment maintenance and/or repair in manufacturing.
• Master's degree in engineering STEM field preferred.
• Requires ability to work on-site in a high-volume manufacturing environment.

Responsibilities

• Own and maintain high-volume manufacturing equipment and processes for precision, safety and efficiency.
• Conduct tests and analyses to monitor critical dimensions and defectivity on the production line.
• Lead improvements to manufacturing techniques, production efficiency and output.
• Enhance safety, quality, cost indicators and productivity across equipment and processes.
• Drive continuous improvement of equipment and process KPIs, collaborating with suppliers.
• Manage installation, conversion and qualification of tools during ramps; ensure safe, timely execution.
• Develop and optimize excursion prevention systems to safeguard equipment and processes.
• Detect and address discrepant material or activities to maintain process integrity.
• Participate in technology transfer, including training and auditing installations at other sites.

Skills

Problem solving

Communication

Education

Bachelor's degree in Engineering

Master's degree in engineering

Job description

Intel Corporation's Wafer Packaging Manufacturing (WPM) C4 OR group in Hillsboro, OR is seeking a Module Engineer to own high‑volume manufacturing equipment and processes, perform tests and optimizations, and drive safety, quality, and productivity improvements on the production line.

You will lead excursions, tool qualification during ramps, participate in technology transfer, and collaborate with suppliers and global teams to ensure consistent, world-class silicon manufacturing.